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PSMN020 Datasheet(PDF) 1 Page - NXP Semiconductors

Part # PSMN020
Description  N-channel TrenchMOS횚 transistor
PDF  7 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

PSMN020 Datasheet(HTML) 1 Page - NXP Semiconductors

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Philips Semiconductors
Product specification
N-channel TrenchMOS
™ transistor
PSMN020-150W
FEATURES
SYMBOL
QUICK REFERENCE DATA
• ’Trench’ technology
• Very low on-state resistance
V
DSS = 150 V
• Fast switching
• Low thermal resistance
I
D = 73 A
R
DS(ON) ≤ 20 mΩ
GENERAL DESCRIPTION
PINNING
SOT429 (TO247)
SiliconMAX products use the latest
PIN
DESCRIPTION
Philips
Trench
technology
to
achieve
the
lowest
possible
1
gate
on-state
resistance
in
each
package at each voltage rating.
2
drain
Applications:-
3
source
• d.c. to d.c. converters
• switched mode power supplies
tab
drain
The PSMN020-150W is supplied in
the SOT429 (TO247) conventional
leaded package.
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
DSS
Drain-source voltage
T
j = 25 ˚C to 175˚C
-
150
V
V
DGR
Drain-gate voltage
T
j = 25 ˚C to 175˚C; RGS = 20 kΩ
-
150
V
V
GS
Gate-source voltage
-
± 20
V
I
D
Continuous drain current
T
mb = 25 ˚C
-
73
A
T
mb = 100 ˚C
-
51
A
I
DM
Pulsed drain current
T
mb = 25 ˚C
-
290
A
P
D
Total power dissipation
T
mb = 25 ˚C
-
300
W
T
j, Tstg
Operating junction and
- 55
175
˚C
storage temperature
AVALANCHE ENERGY LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
E
AS
Non-repetitive avalanche
Unclamped inductive load, I
AS = 73 A;
-
707
mJ
energy
t
p = 100 µs; Tj prior to avalanche = 25˚C;
V
DD ≤ 25 V; RGS = 50 Ω; VGS = 5 V; refer to
fig:15
I
AS
Non-repetitive avalanche
-
73
A
current
d
g
s
2
3
1
November 1999
1
Rev 1.000


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