Data Sheet

HMC1119

Rev. 0 | Page 13 of 15

APPLICATIONS INFORMATION

EVALUATION PRINTED CIRCUIT BOARD

The schematic of the evaluation board, EV2HMC1119LP4M, is

shown in Figure 25. The PCB is four-layer material with a copper

thickness of 0.7 mils on each layer. Each copper layer is separated

with a dielectric material. The top dielectric material is 10-mil

RO4350 with a typical dielectric constant of 3.48. The middle and

bottom dielectric materials are FR-4 material, used for mechanical

strength and to meet the overall board thickness of approximately

62 mils, which allows SMA connectors to be slipped in at board

edges.

All RF and dc traces are routed on the top copper layer. The RF

transmission lines are designed using coplanar waveguide model

(CPWG) with a width of 18 mils, spacing of 17 mils, and dielectric

thickness of 10 mils to maintain 50 Ω characteristic impedance.

The inner and bottom layers are solid ground planes. For optimal

electrical and thermal performance, an ample number of vias are

populated around the transmission lines and under the package

exposed pad. The evaluation board layout serves as a recommend-

ation for the optimal performance on both electrical and thermal

aspects.

Figure 25. EV2HMC1119LP4M Evaluation PCB

Table 7. Bill of Materials

Item

Description

J1, J2

PCB mount SMA connector

J3

18-pin dc connector

TP1, TP2

Through hole mount test point

C1, C3

100 pF

Capacitor, 0402 package

C6

10 μF

Capacitor, 0603 package

C7

1000 pF

Capacitor, 0402 package

R1 to R11

0 Ω

Resistor, 0402 package

R12 to R25

100 kΩ

Resistor, 0402 package

SW1, SW2

SPDT four-position DIP switch

U1

HMC1119 digital attenuator

Analog Devices, Inc.

600-00963-00 evaluation PCB

EV2HMC1119LP4M4 from Analog Devices