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PIC16C83 Datasheet(PDF) 73 Page - Microchip Technology

Part # PIC16C83
Description  8 BIT CMOS EEPROM MICROCONTROLLERS
PDF  117 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

PIC16C83 Datasheet(HTML) 73 Page - Microchip Technology

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© 1995 Microchip Technology Inc.
DS30081F-page 73
PIC16C8X
Applicable Devices 83 R83 84 84A R84
11.2
DC CHARACTERISTICS:
PIC16LC84-04 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40
°C
≤ TA ≤ +85°C for industrial and
0
°C
≤ TA ≤ +70°C for commercial
Parameter
No.
Sym
Characteristic
Min
Typ† Max Units
Conditions
D001
VDD
Supply Voltage
2.0
—
6.0
V
XT, RC, and LP osc configuration
D002
VDR
RAM Data Retention
Voltage (Note 1)
1.5 *
—
—
V
Device in SLEEP mode
D003
VPOR VDD start voltage to
ensure
Power-on Reset
—VSS
—
V
See section on Power-on Reset for details
D004
SVDD VDD rise rate to
ensure
Power-on Reset
0.05*
—
—
V/ms See section on Power-on Reset for details
D010
D010A
D014
IDD
Supply Current
(Note 2)
—
—
—
1.8
7.3
60
4.5
10
400
mA
mA
µA
RC and XT osc configuration (Note 4)
FOSC = 2 MHz, VDD = 5.5V
FOSC = 2 MHz, VDD = 5.5V
(During EEPROM programming)
LP osc configuration
FOSC = 32 kHz, VDD = 2.0V
WDT disabled
D020
D021
D021A
IPD
Power-down Current
(Note 3)
—
—
—
26
26
26
100
100
100
µA
µA
µA
VDD = 2.0V, WDT enabled,
-40
°C to +85°C
VDD = 2.0V, WDT disabled,
0
°C to +70°C
VDD = 2.0V, WDT disabled, -40
°C to +85°C
*
These parameters are characterized but not tested.
†
Data in "Typ" column is at 5.0V, 25
°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1=external square wave, from rail to rail; all I/O pins tristated, pulled to VDD, T0CKI = VDD,
MCLR = VDD; WDT enabled/disabled as specified.
3: The power down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be
estimated by the formula IR = VDD/2Rext (mA) with Rext in kOhm.



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