18F452 datasheet(265/332 Pages) MICROCHIP

265 / 332 page

 2002 Microchip Technology Inc.

DS39564B-page 263

PIC18FXX2

IDD

Supply Current(2,4) (Continued)

D010C

PIC18LFXX2

—

EC, ECIO osc configurations

VDD = 4.2V, -40

°C to +85°C

D010C

PIC18FXX2

—

EC, ECIO osc configurations

VDD = 4.2V, -40

°C to +125°C

D013

PIC18LFXX2

—

HS osc configuration

FOSC = 4 MHz, VDD = 2.0V

FOSC = 25 MHz, VDD = 5.5V

HS + PLL osc configurations

FOSC = 10 MHz, VDD = 5.5V

D013

PIC18FXX2

—

HS osc configuration

FOSC = 25 MHz, VDD = 5.5V

HS + PLL osc configurations

FOSC = 10 MHz, VDD = 5.5V

D014

PIC18LFXX2

—

µA

Timer1 osc configuration

FOSC = 32 kHz, VDD = 2.0V

D014

PIC18FXX2

—

200

250

µA

Timer1 osc configuration

FOSC = 32 kHz, VDD = 4.2V, -40

°C to +85°C

FOSC = 32 kHz, VDD = 4.2V, -40

°C to +125°C

IPD

Power-down Current(3)

D020

PIC18LFXX2

—

.08

µA

VDD = 2.0V, +25

°C

VDD = 2.0V, -40

°C to +85°C

VDD = 4.2V, -40

°C to +85°C

D020

D021B

PIC18FXX2

—

µA

VDD = 4.2V, +25

°C

VDD = 4.2V, -40

°C to +85°C

VDD = 4.2V, -40

°C to +125°C

22.1

DC Characteristics: PIC18FXX2 (Industrial, Extended)

PIC18LFXX2 (Industrial) (Continued)

PIC18LFXX2

(Industrial)

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40°C

≤ TA ≤ +85°C for industrial

PIC18FXX2

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40°C

≤ TA ≤ +85°C for industrial

-40°C

≤ TA ≤ +125°C for extended

Param

No.

Symbol

Characteristic

Min

Typ

Max Units

Conditions

Legend: Shading of rows is to assist in readability of the table.

Note 1: This is the limit to which VDD can be lowered in SLEEP mode, or during a device RESET, without losing RAM data.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin

loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an

impact on the current consumption.

The test conditions for all IDD measurements in active Operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD

MCLR = VDD; WDT enabled/disabled as specified.

3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is

measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS, and all

features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR,...).

4: For RC osc configuration, current through REXT is not included. The current through the resistor can be

estimated by the formula Ir = VDD/2REXT (mA) with REXT in kOhm.

5: The LVD and BOR modules share a large portion of circuitry. The

∆IBOR and ∆ILVD currents are not additive.

Once one of these modules is enabled, the other may also be enabled without further penalty.

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