MB91F465KB datasheet(83/86 Pages) CYPRESS

83 / 86 page

MB91460K Series

Document Number: 002-04602 Rev. *A

Page 83 of 86

17. Package Dimension

120-pin plastic LQFP

Lead pitch

0.50 mm

Package width

package length

16.0

× 16.0 mm

Lead shape

Gullwing

Sealing method

Plastic mold

Mounting height

1.70 mm MAX

Weight

0.88 g

Code

(Reference)

P-LFQFP120-16

×16-0.50

120-pin plastic LQFP

(FPT-120P-M21)

2002 FUJITSU LIMITED F120033S-c-4-4

120

18.00±0.20(.709±.008)SQ

0.50(.020)

0.22±0.05

(.009±.002)

0.08(.003)

INDEX

.006 –.001

+.002

–0.03

+0.05

0.145

"A"

0.08(.003)

LEAD No.

.059 –.004

+.008

–0.10

+0.20

1.50

Details of "A" part

(Mounting height)

0.60±0.15

(.024±.006)

0.25(.010)

(.004±.002)

0.10±0.05

(Stand off)

0~8˚

.630 –.004

+.016

–0.10

+0.40

16.00

Dimensions in mm (inches).

Note: The values in parentheses are reference values.

Note 1) * : These dimensions do not include resin protrusion.

Resin protrusion is +0.25(.010) MAX(each side).

Note 2) Pins width and pins thickness include plating thickness.

Note 3) Pins width do not include tie bar cutting remainder.

MB91F465KB Datasheet(PDF) 83 Page - Cypress Semiconductor

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