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ZSC31014EAC Datasheet(PDF) 53 Page - Integrated Device Technology |
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ZSC31014EAC Datasheet(HTML) 53 Page - Integrated Device Technology |
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53 / 58 page ![]() ZSC31014 Datasheet © 2016 Integrated Device Technology, Inc. 53 January 20, 2016 5 ESD/Latch-Up-Protection All pins have an ESD protection of >4000V and a latch-up protection of ±100mA or (up to +8V / down to –4V) relative to VSS/VSSA. ESD protection referenced to the Human Body Model is tested with devices in SOP-8 packages during product qualification. The ESD test follows the Human Body Model with 1.5kOhm/100pF based on MIL 883, Method 3015.7. 6 Pin Configuration and Package The standard package of the ZSC31014 is SOP-8 (3.81mm body (150mil) wide) with lead-pitch 1.27mm (50mil). See the notes in Table 6.2 regarding connection requirements. Table 6.1 Storage and Soldering Conditions for the SOP-8 Package Parameter Symbol Conditions Min Typ Max Unit Maximum Storage Temperature Tmax_storage Less than 10hrs, before mounting 150 °C Minimum Storage Temperature: Tmin_storage Store in original packing only -50 °C Maximum Dry-Bake Temperature Tdrybake Less than100 hrs total, before mounting 125 °C Soldering Peak Temperature Tpeak Less than 30s (IPC/JEDEC-STD-020 Standard) 260 °C |
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