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96

591D

Vishay Sprague

Document Number 40012

Revision 22-Nov-04

For technical questions, contact tantalum@vishay.com

6.

Printed Circuit Board Materials: The capacitors are

compatible with most commonly used printed circuit

board materials (alumina substrates, FR4, FR5,

G10, PTFE-fluorocarbon and porcelanized steel). If

your desired board material is not shown there please

contact the Tantalum Marketing Department for

assistance in determining compatibility.

7.

Attachment:

7.1

Solder Paste: The recommended thickness of the

solder paste after application is 0.007" ± 0.001"

[0.178mm ± 0.025mm]. Care should be exercised in

selecting the solder paste. The metal purity should

be as high as practical. The flux (in the paste) must

be active enough to remove the oxides formed on the

metallization prior to the exposure to soldering heat.

7.2

Soldering: Capacitors can be attached by

conventional soldering techniques - convection,

infrared reflow, wave soldering and hot plate methods.

The Soldering Profile chart shows typical recomended

time/temperature conditions for soldering. Attachment

with a soldering iron is not recommended due to the

difficulty of controlling temperature and time at

temperature. The soldering iron must never come in

contact with the capacitor.

5.

Power Dissipation: Power dissipation will be affected

by the heat sinking capability of the mounting surface.

Non-sinusoidal ripple current may produce heating

effects which differ from those shown. It is important

that the equivalent

calculating permissible operating levels. (Power

dissipation calculated using + 25°C temperature rise.)

7.1

Recommended Mounting Pad Geometries: The

nib must have sufficient clearance to avoid electrical

contact with other components. The width dimension

indicated is the same as the maximum width of the

capacitor. This is to minimize lateral movement.

8.

Cleaning (Flux Removal) After Soldering: The

capacitors are compatible with all commonly used

solvents such as TES, TMS, Prelete, Chlorethane,

Terpene and aqueous cleaning media. Solvents

containing methylene chloride or other epoxy solvents

should be avoided since these will attack the epoxy

encapsulation material.

Case Code

Maximum Permissible

Power Dissipation

@ + 25

A

B

C

D

R

U

V

W

0.075

0.085

0.110

0.150

0.165

0.110

0.140

0.175

Temperature

Derating Factor

+ 25°C

+ 85°C

+ 125°C

1.0

0.9

0.4

4.0

Reverse Voltage: These capacitors are capable of

withstanding peak voltages in the reverse direction

equal to 10% of the DC rating or 1 volt maximum at

+ 25°C and 5% of the DC voltage rating or 0.5 volt

maximum at + 85°C.

5.0

Temperature Derating: If these capacitors are to be

operated at temperatures above + 25°C, the

permissible rms ripple current or voltage shall be

calculated using the derating factors as shown:

* Pads for B, C and D case codes are otherwise pad compatible with

* Type 293D, B, C and D case codes respectively.

REFLOW SOLDER PADS* in inches [millimeters]

A

B

B

C

CASE

WIDTH

PAD

SEPARATION

CODE

(A)

METALIZATION

(C)

A

0.083

0.067

0.050

[2.1]

[1.7]

[1.3]

B

0.138

0.067

0 .067

[3.5]

[1.7]

[1.7]

C

0.138

0.090

0.127

[3.5]

[2.3]

[3.1]

D

0.180

0.090

0.145

[4.6]

[2.3]

[3.7]

R

0.322

0.090

0.145

[8.1]

[2.3]

[3.7]

U

0.138

0.090

0.122

[3.5]

[2.3]

[3.1]

V

0.180

0.090

0.145

[4.6]

[2.3]

[3.7]

W

0.327

0.090

0.145

[8.3]

[2.3]

[3.7]

250

200

150

100

50

TIME (SECONDS)

0

50

100

150

200

250

300

350

RECOMMENDED REFLOW SOLDERING PROFILE

GUIDE TO APPLICATION