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BL600-SC Datasheet(PDF) 39 Page - Laird Tech Smart Technology |
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BL600-SC Datasheet(HTML) 39 Page - Laird Tech Smart Technology |
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39 / 50 page ![]() Single Mode BLE Modules Datasheet Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth 39 © Copyright 2017 Laird. All Rights Reserved Americas: +1-800-492-2320 Europe: +44-1628-858-940 Hong Kong: +852 2923 0610 Any modules not manufactured before exceeding their floor life should be re-packaged with fresh desiccate and a new humidity indicator card. Floor life for MSL (Moisture Sensitivity Level) 3 devices is 168 hours in ambient environment 30°C/60%RH. Table 20: Recommended baking times and temperatures MSL 125°C Baking Temp. 90°C/≤ 5%RH Baking Temp. 40°C/ ≤ 5%RH Baking Temp. Saturated @ 30°C/85% Floor Life Limit + 72 hours @ 30°C/60% Saturated @ 30°C/85% Floor Life Limit + 72 hours @ 30°C/60% Saturated @ 30°C/85% Floor Life Limit + 72 hours @ 30°C/60% 3 9 hours 7 hours 33 hours 23 hours 13 days 9 days Laird surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB. Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the requirements of the solder paste. Laird surface mount modules conform to J-STD-020D1 standards for reflow temperatures. Important: During reflow, modules should not be above 260° and not for more than 30 seconds. Figure 16: Recommended Reflow Temperature Temperatures should not exceed the minimums or maximums presented in Table 21. Table 21: Recommended Maximum and minimum temperatures Specification Value Unit Temperature Inc./Dec. Rate (max) 1~3 °C / Sec Temperature Decrease rate (goal) 2-4 °C / Sec Soak Temp Increase rate (goal) .5 - 1 °C / Sec Flux Soak Period (Min) 70 Sec Flux Soak Period (Max) 120 Sec Flux Soak Temp (Min) 150 °C |
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