SSD45N

Datasheet

Embedded Wireless Solutions Support Center:

http://ews-support.lairdtech.com

www.lairdtech.com/wireless

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We recommend that the peak temperature at the solder joint be within 240°C ~ 250°C and the maximum

component temperature should not exceed 250°C.

We recommend that time above 220°C for the solder joints is between 60-80 seconds, and with a minimum of

50 seconds.

Excessive ramp/cooling rates (>3°C/second) should be avoided.

To develop the reflow profile, we recommend that you place thermocouples at various locations on the

assembly to confirm that all locations meet the profile requirements. The critical locations are the solder joints

of SiP Module. We also recommend that you use the actual fully loaded assembly to account for the total

thermal mass.

The following is a list of RF layout design guidelines and recommendation when installing a Laird radio into your

device.



Do not run antenna cables directly above or directly below the radio.



Do not place any parts or run any high speed digital lines below the radio.



If there are other radios or transmitters located on the device (such as a Bluetooth radio), place the devices

as far apart from each other as possible.



Ensure that there is the maximum allowable spacing separating the antenna connectors on the Laird radio

from the antenna. In addition, do not place antennas directly above or directly below the radio.



Laird recommends the use of a double shielded cable for the connection between the radio and the

antenna elements.



Laird has provided three plated mounting holes that can be used for grounding. When additional ground

plane is required, you may use some or all of these grounded mounting holes.



Use proper electro-static-discharge (ESD) procedures when installing the Laird radio module.



For system schematic relative module, please don’t put via on module’s pad. To avoid void occupy on

solder paste pad.



Need to place enough ground via under the SSD45NBT.