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LM5112 Datasheet(PDF) 9 Page - National Semiconductor (TI) |
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LM5112 Datasheet(HTML) 9 Page - National Semiconductor (TI) |
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9 / 10 page ![]() Thermal Performance (Continued) For LLP-6 package, the integrated circuit die is attached to leadframe die pad which is soldered directly to the printed circuit board. This substantially decreases the junction to ambient thermal resistance ( θ JA). By providing suitable means of heat dispersion from the IC to the ambient through exposed copper pad, which can readily dissipate heat to the surroundings, θ JA as low as 40˚C / Watt is achievable with the package. The resulting Trise for the driver example above is thereby reduced to just 5.5 degrees. Therefore T RISE is equal to T RISE = 0.138 x 40 = 5.5˚C www.national.com 9 |
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