196HVC datasheet(13/15 Pages) VISHAY

13 / 15 page

196 HVC ENYCAP™

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Vishay BCcomponents

Revision: 13-Jan-17

Document Number: 28409

For technical questions, contact: hybridstorage@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

PRODUCT AND MOUNTING CHARACTERISTICS

Attention: parts are pre-charged at delivery - handle appropriate.

At delivery products are pre-charged and voltage over terminals is near nominal voltage. Short circuiting of product terminals

is permitted. Do not short circuit permanently. Short circuiting of charged cells may heat up the cells. Cells will fulfill UL 2054 -

Tcell < 150 °C due to self heating in case of short circuiting. Products are UL 810A recognized.

For printed circuit board mounting it has to be taken into account, that for certain form factors top and bottom of products may

not be insulated.

Capacitor disposal methods should be in accordance with local and state regulations.

Table 6.1

Notes

(1) n... number of cells

(2) RI equals ESRAC or ESRDC.

Table 6.2: Stacked Through Hole configuration (STH), Surface Mount Flat configuration (SMF), and Lay Flat

configuration with Connector

Notes

• Robustness - bending limited to ± 15°, force in direction of tab / pin, no twisting allowed.

• Solder bath test: max. allowed case temperature during test is e.g. 85 °C or immersion of one (1) pad only.

• Wave soldering allowed.

(1) RI equals ESRAC or ESRDC.

TEST PROCEDURES AND REQUIREMENTS

NAME OF TEST

ENYCAP

TESTS

SUBCLAUSE

PROCEDURE

(quick reference)

REQUIREMENTS (2)

Damp heat, steady state

4.12

500 h at 55 °C; RH 90 % to 95 %; no voltage applied

C/C: ± 30 %

RI  4 x spec. limit

IL  2 x spec. limit

Endurance

4.13.1

Tamb = 70 °C / 85 °C; rated voltage UR applied;

4.0 F, 15 F: 1000 h



45 F, 90 F: 2000 h

C/C: ± 30 %

RI  4 x spec. limit

IL  2 x spec. limit

Useful life

4.13.2

Tamb = 70 °C / 85 °C; rated voltage UR applied;

4.0 F, 15 F: 1000 h



45 F, 90 F: 2000 h

C/C: ± 30 %

RI  4 x spec. limit

IL  2 x spec. limit

Storage at upper category

temperature

4.17

Tamb = 70 °C / 85 °C; no voltage applied;

1000 h

C/C: ± 30 %

RI  4 x spec. limit

IL  2 x spec. limit

Self discharge

4.1.5

24 h storage at room temperature after application



of UR for 1 h

Remaining voltage:

 (U

R x 0.9)

Characteristics at high and

low temperature

4.19

Step 1: reference measurement at 20 °C of C, RI, and IL

Step 2: measurement at -20 °C



Step 3: measurement at +20 °C



Step 4: measurement at +70 °C



Step 5: measurement at +20 °C

C/C: ± 30 % of +20 °C value

RI  5 x the +20 °C value

IL  4 x the +20 °C value

Surge voltage

4.15

Max. 30 s at room temperature



US = n (1) x 1.6 V

No change of parameter!



After surge voltage, discharge

product below rated voltage

TEST PROCEDURES AND REQUIREMENTS

NAME OF TEST

ENYCAP

TESTS

SUBCLAUSE

PROCEDURE

(quick reference)

REQUIREMENTS (1)

Robustness of terminations

4.4

Tensile strength; application of load force in pin / tab

direction for 10 s:



10 N: for product size Ø

 8 mm

5 N: for product size Ø < 8 mm

No breaks

Resistance to soldering heat

4.5

260 °C; 5 s

C/C: ± 10 %

RI and IL  spec. limit

Solderability

4.6

Solder bath; 236 °C; 2 s; one pin immersed

 75 % tinning

Vibration

4.8

10 Hz to 55 Hz; 1.5 mm; 3 directions;



2 h per direction

C/C: ± 10 %

RI and IL  spec. limit

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