OM183SC - OM186ST - OM186SR

OM

183

S

R

M

Omnirel

Device

Isolated

Package

Hi-Rel Screening

Type

Package

Style

Level

PART NUMBER DESIGNATOR

Figure 1 shows a typical soldering profile for the D2 and D3 Packages when soldering a to a printed circuit board. The

profile will vary from system to system and solders to solders. Factors that can affect the profile include the type of sol-

dering system used, density and type of components on the board or substrate material being used. This profile shows

temperature versus time. The two profiles described are based on a high density and a low density board. The type sol-

der used was 62/36/2 Tin Lead Silver with a melting point between 177-189ºC. An convection/infrared soldering reflow

system was used. The circuit and solder joints heat up first due to their mass followed by the components which typi-

cally run 30 degrees cooler than the solder joints.

TYPICAL HEATING PROFILE

TYPICAL SOLDERING PROFILE

MECHANICAL OUTLINE

SOLDERING FOOTPRINT

Pin 1: Adjust

Pin 2: Vout

Pin 3: Vin

Case N/C

205 Crawford Street, Leominster, MA 01453 USA (508) 534-5776 FAX (508) 537-4246

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