| Electronic Components Datasheet Search |
|
AM29LV640MU Datasheet(PDF) 56 Page - Advanced Micro Devices |
|
|
|||||||||||||||||||||||||||||
AM29LV640MU Datasheet(HTML) 56 Page - Advanced Micro Devices |
|
56 / 58 page ![]() June 12, 2003 Am29LV640MU 55 AD V A NCE INF O R M A T IO N REVISION SUMMARY Revision A (August 3, 2001) Initial release as abbreviated Advance Information data sheet. Revision A+1 (September 12, 2001) Global Changed description of chip-scale package from 63-ball FBGA to 64-ball Fortified BGA. Ordering Information Changed package part number designation from WH to PC. Physical Dimensions Added the TS056 and LAA064 packages. Revision A+2 (October 3, 2001) Global Added inform ation fo r WP# protected devices (LV640MH/L). Clarified VCC and VIO ranges. Connection Diagrams Changed RFU (reserved for future use) to NC (no con- nection). Added 63-ball FBGA drawing. Ordering Information Added H and L valid combinations for WP# protected devices. Changed voltage operating range for 90 ns device. Revision B (March 19, 2002) Global Expanded data sheet to full specification version. Starting with this revision, the data sheet will only con- tain specifications for the Am29LV640MU part num- ber. For Am29LV640MH/L part number specifications, refer to publication number 26191. Revision B+1 (April 26, 2002) Global Deleted references to word mode. MirrorBit 64 Mbit Device Family Deleted Am29LV641MT/B. Figure 2, In-System Sector Group Protect/Unprotect Algorithms Modified to show A2, A3 address requirements. Sector Protection/Unprotection Deleted references to alternate method of sector pro- tection. Autoselect Command Substituted text with ID code table for easier refer- ence. Table 10, Command Definitions Combined Notes 4 and 5 from Revision B. Corrected number of cycles indicated for Write-to-Buffer and Au- toselect Device ID command sequences. Revision B+2 (August 5, 2002) MIRRORBIT 64 MBIT Device Family Added 64 Fortified BGA to LV640MU device. Alternate CE# Controlled Erase and Program Operations Added tRH parameter to table. Erase and Program Operations Added t BUSY parameter to table. Figure 16. Program Operation Timings Added RY/BY# to waveform. TSOP and BGA PIN Capacitance Added the FBGA package. Program Suspend/Program Resume Command Sequence Changed 15 µs typical to maximum and added 5 µs typical. Erase Suspend/Erase Resume Commands Changed typical from 20 µs to 5 µs and added a maxi- mum of 20 µs. Revision B+3 (September 10, 2002) Product Selector Guide Added Note 2. Ordering Information Added Note 1. Connection Diagram Deleted A-1 from Pin G7. Sector Erase Command Sequence Deleted statement that describes the outcome of when the Embedded Erase operation is in progress. |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |