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IIS328DQ Datasheet(PDF) 37 Page - STMicroelectronics |
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IIS328DQ Datasheet(HTML) 37 Page - STMicroelectronics |
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37 / 40 page ![]() DocID027250 Rev 3 37/40 IIS328DQ Soldering information 40 9.2.1 PCB design rules Figure 13. Recommended land and solder mask design for QFPN packages A = Clearance from PCB land edge to solder mask opening 0.1 mm to ensure that some solder mask remains between PCB pads B = PCB land length = QFPN solder pad length + 0.1 mm C = PCB land width = QFPN solder pad width + 0.1 mm D = PCB thermal pad solder mask opening = QFPN thermal pad side + 0.2 mm |
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