LSM330D datasheet(31/66 Pages) STMICROELECTRONICS

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LSM330D

Application hints

Doc ID 022562 Rev 2

31/66

Application hints

Figure 13.

LSM330D electrical connection

5.1

External capacitors

The device core is supplied through Vdd line. Power supply decoupling capacitors (C1=C3 =

100 nF ceramic, C2=10 µF Al) should be placed as near as possible to the supply pin of the

device (common design practice).

All the voltage and ground supplies must be present at the same time to have proper

behavior of the IC (refer to Figure 13). The functionality of the device and the measured

acceleration/angular rate data are selectable and accessible through the SPI/I2C interface.

The functions, the threshold and the timing of the two interrupt pins for each sensor can be

completely programmed by the user though the SPI/I2C interface.

5.2

Soldering information

The LGA package is compliant with ECOPACK®, RoHS and “Green” standards. It is

qualified for soldering heat resistance according to JEDEC J-STD-020D.

Leave “Pin 1 Indicator” unconnected during soldering.

Land pattern and soldering recommendations are available at www.st.com/mems.

DIRECTION OF

DETECTABLE

ACCELERATIONS

DIRECTION OF

DETECTABLE

ANGULAR RATE

FILTVDD

FILTIN Y

(BOTTOM VIEW)

RES

LSM330D

RES

DRDY_G

INT2_A

INT1_A

INT1_G

RES

GND

Vdd

GND

Vdd_IO

GND

100 nF

Digital signal from/to signal controller.Signals levels are defined by proper selection of Vdd

100 nF

10 µF

+Ω

AM10233V1

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