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STDLED627 Datasheet(PDF) 5 Page - STMicroelectronics

Part # STDLED627
Description  N-channel 620 V, 0.95 Ω, 7.0 A Power MOSFET in D2PAK and in DPAK
PDF  18 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STDLED627 Datasheet(HTML) 5 Page - STMicroelectronics

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DocID025173 Rev 1
5/18
STBLED627, STDLED627
Electrical characteristics
The built-in back-to-back Zener diodes have specifically been designed to enhance not only
the device’s ESD capability, but also to make them safely absorb possible voltage transients
that may occasionally be applied from gate to source. In this respect the Zener voltage is
appropriate to achieve an efficient and cost-effective intervention to protect the device’s
integrity. These integrated Zener diodes thus avoid the usage of external components.
Table 6. Switching times
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
td(on)
Turn-on delay time
VDD = 310 V, ID = 2.75 A,
RG = 4.7 Ω, VGS = 10 V
(see Figure 17)
-22
-
ns
tr
Rise time
-
12
-
ns
td(off)
Turn-off-delay time
-
49
-
ns
tf
Fall time
-
20
-
ns
Table 7. Source-drain diode
Symbol
Parameter
Test conditions
Min.
Typ.
Max. Unit
ISD
Source-drain current
-
5.5
A
ISDM
(1)
1.
Pulse width limited by safe operating area.
Source-drain current (pulsed)
27
A
VSD
(2)
2.
Pulsed: pulse duration = 300 µs, duty cycle 1.5%.
Forward on voltage
ISD = 5.5 A, VGS = 0
-
1.5
V
trr
Reverse recovery time
ISD = 5.5 A, di/dt = 100 A/µs
VDD = 60 V (see Figure 22)
-290
ns
Qrr
Reverse recovery charge
-
1900
nC
IRRM
Reverse recovery current
-
13.5
A
trr
Reverse recovery time
ISD = 5.5 A, di/dt = 100 A/µs
VDD = 60 V, Tj = 150 °C
(see Figure 22)
-335
ns
Qrr
Reverse recovery charge
-
2400
nC
IRR
Reverse recovery current
-
14.5
A
Table 8. Gate-source Zener diode
Symbol
Parameter
Test conditions
Min.
Typ.
Max. Unit
V(BR)GSO
Gate-source breakdown
voltage (ID = 0)
Igs = ± 1 mA
30
-
V



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