Electronic Components Datasheet Search
  English  ▼

X  

REF3133-Q1 Datasheet(PDF) 17 Page - Texas Instruments

Part # REF3133-Q1
Description  15 ppm Maximum, 100-uA, SOT-23 Series Voltage Reference
PDF  23 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

REF3133-Q1 Datasheet(HTML) 17 Page - Texas Instruments

Back Button REF3133-Q1 Datasheet HTML 13Page - Texas Instruments REF3133-Q1 Datasheet HTML 14Page - Texas Instruments REF3133-Q1 Datasheet HTML 15Page - Texas Instruments REF3133-Q1 Datasheet HTML 16Page - Texas Instruments REF3133-Q1 Datasheet HTML 17Page - Texas Instruments REF3133-Q1 Datasheet HTML 18Page - Texas Instruments REF3133-Q1 Datasheet HTML 19Page - Texas Instruments REF3133-Q1 Datasheet HTML 20Page - Texas Instruments REF3133-Q1 Datasheet HTML 21Page - Texas Instruments Next Button
Zoom Inzoom in Zoom Outzoom out
 17 / 23 page
background image
OUT
GND
IN
C
C
REF31xx-Q1
To Input Power Supply
Via to Ground Plane
17
REF3112-Q1, REF3120-Q1, REF3125-Q1
REF3130-Q1, REF3133-Q1, REF3140-Q1
www.ti.com
SBVS299 – APRIL 2017
Product Folder Links: REF3112-Q1 REF3120-Q1 REF3125-Q1 REF3130-Q1 REF3133-Q1 REF3140-Q1
Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
10 Power Supply Recommendations
The REF31xx-Q1 family of references features an extremely low dropout voltage. With the exception of the
REF3112, which has a minimum supply requirement of 1.8 V, these references can be operated with a supply of
only 5 mV above the output voltage in an unloaded condition. For loaded conditions see Figure 4. TI
recommends a supply bypass capacitor greater than 0.47 μF.
11 Layout
11.1 Layout Guidelines
Figure 33 shows an example of a printed-circuit board (PCB) layout using the REF31xx-Q1. Some key
considerations are:
•
Connect low-ESR, 0.1-μF ceramic bypass capacitors at VIN of the REF31xx-Q1.
•
Decouple other active devices in the system per the device specifications.
•
Use a solid ground plane to help distribute heat and reduces electromagnetic interference (EMI) noise pickup.
•
Place the external components as close as possible to the device. This configuration prevents parasitic errors
(such as the Seebeck effect) from occurring.
•
Minimize trace length between the reference and bias connections to the INA and ADC to reduce noise
pickup.
•
Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if
possible, and only make perpendicular crossings when absolutely necessary.
11.2 Layout Example
Figure 33. Layout Example



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com