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MIPSZ2012D3R3 Datasheet(PDF) 44 Page - STMicroelectronics |
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MIPSZ2012D3R3 Datasheet(HTML) 44 Page - STMicroelectronics |
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44 / 48 page  Package information TS4621B 44/48 Doc ID 022194 Rev 2 5 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 87. TS4621B footprint recommendation Figure 88. Pinout 150 μm min. 400 μm 400 μm PCB pad size: Φ = 260 µm maximum Φ = 220 µm recommended 75 µm min. 100 μm max. Track Not soldered mask opening Solder mask opening: Φ = 300 μm min (for 260 µm diameter pad) Pad in Cu 18 μm with Flash NiAu (2-6 μm, 0.2 μm max.) TOP VIEW (balls are underneath) BOTTOM VIEW AVDD SW INL - C1 CMS SDA AGND C2 HPVDD VOUTL VOUTR INL+ INR+ PVSS SCL INR - 4 3 21 A B C D C1 C2 HPVDD AVDD AGND PVSS CMS VOUTR VOUTL INL+ INR+ INL - INR - SCL SDA SW 12 3 4 A B C D |
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