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MIPSZ2012D3R3 Datasheet(PDF) 45 Page - STMicroelectronics

Part # MIPSZ2012D3R3
Description  High-performance class-G stereo headphone amplifier with I2C volume control
PDF  48 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

MIPSZ2012D3R3 Datasheet(HTML) 45 Page - STMicroelectronics

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background image
TS4621B
Package information
Doc ID 022194 Rev 2
45/48
Figure 89.
Marking (top view)
Figure 90.
Flip-chip - 16 bumps
Figure 91.
Device orientation in tape pocket
■
Logo: ST
■ Symbol for lead-free: E
■ Part number: 21
■ X digit: Assembly code
■
Date code: YWW
■
The dot marks pin A1
21X
YWW
E
21X
YWW
E
400
μm
1650
μm
1650
μm
■
Die size: 1.65 mm x 1.65 mm ± 30 µm
■
Die height (including bumps): 600 µm
±55 µm
■
Bump diameter: 250 µm ±40 µm
■
Bump height: 205 µm ±35 µm
■
Die height: 395 µm ±20 µm
■
Pitch: 400 µm ±40 µm
■
Coplanarity: 50 µm max
4
1.5
User direction of feed
8
Die size X + 70 µm
4
All dimensions are in mm
A
1
A
1



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