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ADG3245 Datasheet(PDF) 11 Page - Analog Devices |
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ADG3245 Datasheet(HTML) 11 Page - Analog Devices |
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11 / 12 page ![]() PRELIMINARY TECHNICAL DATA REV. Pr E ADG3245 –11– OUTLINE DIMENSIONS 20-Lead Chip Scale Package [LFCSP] 4 4 mm Body (CP-20) Dimensions shown in millimeters 1 20 5 6 11 16 15 BOTTOM VIEW 10 2.25 2.10 SQ 1.95 0.75 0.55 0.35 0.30 0.23 0.18 0.50 BSC 12 MAX 0.25 REF 0.70 MAX 0.65 NOM 0.05 0.02 0.00 1.00 0.90 0.80 SEATING PLANE PIN 1 INDICATOR TOP VIEW 3.75 BSC SQ 4.0 BSC SQ COPLANARITY 0.08 COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1 0.60 MAX 0.60 MAX 20-Lead Thin Shrink Small Outline Package [TSSOP] (RU-20) Dimensions shown in millimeters 20 1 11 10 6.40 BSC 4.50 4.40 4.30 PIN 1 6.60 6.50 6.40 SEATING PLANE 0.15 0.05 0.30 0.19 0.65 BSC 1.20 MAX 0.20 0.09 0.75 0.60 0.45 8 0 COMPLIANT TO JEDEC STANDARDS MO-153AC COPLANARITY 0.10 |
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