PRELIMINARY TECHNICAL DATA

REV. Pr

E

ADG3245

–3–

ABSOLUTE MAXIMUM RATINGS

*

°C, unless otherwise noted.)

Digital Inputs to GND . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V

DC Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V

DC Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . . . –40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150

°C

LFCSP Package

30.4

°C/W

TSSOP Package

. . . . . . . . . . . . . . . . . . . .

143

°C/W

Lead Temperature, Soldering (10 seconds) . . . . . . . . . . 300

°C

IR Reflow, Peak Temperature (<20 seconds) . . . . . . . . 235

°C

*Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability. Only one absolute

maximum rating may be applied at any one time.

Table I. Pin Description

Pin Mnemonic

Description

BE

Bus Enable (Active Low)

SEL

Level Translation Select

Ax

Port A, Inputs or Outputs

Bx

Port B, Inputs or Outputs

Table II. Truth Table

BE

SEL*

Function

LL

A = B, 3.3 V to 1.8 V Level Shifting

LH

A = B, 3.3 V to 2.5 V/2.5 V to 1.8 V Level Shifting

HX

Disconnect

*SEL = 0 V only when VDD = 3.3 V

± 10%

PIN CONFIGURATION

20-Lead LFCSP and 20-Lead TSSOP

15

BE

14 B0

13 B1

12 B2

SEL 1

A4 2

A5 3

11 B3

A6 4

A7 5

PIN 1

INDICATOR

TOP VIEW

ADG3245

TOP VIEW

(Not to Scale)

20

19

18

17

16

15

14

13

12

11

1

2

3

4

5

6

7

8

9

10

ADG3245

GND

A7

A6

A0

A1

A2

A5

A4

A3

B7

B6

B5

BE

B0

B1

B4

B3

B2

SEL

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although the

ADG3245 features proprietary ESD protection circuitry, permanent damage may occur on devices

subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended

to avoid performance degradation or loss of functionality.

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

ADG3245BCP

–40

°C to +85°CLeaded Chip Scale Package (LFCSP)

CP-20

ADG3245BRU

–40

°C to +85°CThin Shrink Small Outline Package (TSSOP)

RU-20