P

y

SPC11A

9. PACKAGE/PAD LOCATIONS

9.1. PAD Assignment

Chip Size: 1370

This IC substrate should be connected to VSS

Note1: Chip size included scribe line.

Note2: The 0.1

µF capacitor between VDD and VSS should be placed to IC as close as possible.

9.2. Ordering Information

Product Number

Package Type

SPC11A-nnnnV-C

Chip form

Note1: Code number (nnnnV) is assigned for customer.

Note2: Code number (nnnn = 0000 - 9999); version (A = A - Z).

© Sunplus Technology Co., Ltd.

Proprietary & Confidential

11

JUL. 09, 2001

Preliminary Version: 0.1