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HCPL-9000 Datasheet(PDF) 7 Page - Agilent(Hewlett-Packard)

Part # HCPL-9000
Description  High Speed Digital Isolators
PDF  12 Pages
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Manufacturer  HP [Agilent(Hewlett-Packard)]
Direct Link  http://www.home.agilent.com
Logo HP - Agilent(Hewlett-Packard)

HCPL-9000 Datasheet(HTML) 7 Page - Agilent(Hewlett-Packard)

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7
Insulation and Safety Related Specifications
Parameters
Condition
Min.
Typ.
Max.
Units
Barrier Impedance
Ω||pF
Single Channel
>1014||3
Dual Channel
>1014||3
Quad Channel
>10
14||7
Creepage Distance (External)
mm
8-Pin PDIP
7.036
8-Pin SOIC
4.026
16-Pin SOIC Narrow Body
4.026
16-Pin SOIC Wide Body
8.077
Leakage Current
240 V
RMS
0.2
µA
60 Hz
Absolute Maximum Ratings
Parameters
Symbol
Min.
Max.
Units
Storage Temperature
T
S
–55
175
°C
Ambient Operating Temperature[1]
T
A
–55
125
°C
Supply Voltage
V
DD1, VDD2
–0.5
7
V
Input Voltage
V
IN
–0.5
V
DD1 +0.5
V
Voltage Output Enable (HCPL-9000/-0900)
V
OE
–0.5
V
DD2 +0.5
V
Output Voltage
V
OUT
–0.5
V
DD2 +0.5
V
Output Current Drive
I
OUT
10
mA
Lead Solder Temperature (10s)
260
°C
ESD
2 kV Human Body Model
Notes:
1. Absolute Maximum ambient operating temperature means the device will not be damaged if operated under these conditions. It does not
guarantee performance.
Recommended Operating Conditions
Parameters
Symbol
Min.
Max.
Units
Ambient Operating Temperature
T
A
–40
100
°C
Supply Voltage
V
DD1, VDD2
3.0
5.5
V
Logic High Input Voltage
V
IH
2.4
V
DD1
V
Logic Low Input Voltage
V
IL
0
0.8
V
Input Signal Rise and Fall Times
t
IR, tIF
1
µs
This product has been tested for electrostatic sensitivity to the limits stated in the specifications. However, Agilent recommends that all integrated circuits
be handled with appropriate care to avoid damage. Damage caused by inappropriate handling or storage could range from performance degradation to
complete failure.



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