Electronic Components Datasheet Search
  English  ▼

X  

EC3689 Datasheet(PDF) 7 Page - E-CMOS Corporation

Part # EC3689
Description  800KHz Synchronous Step-up Converter with 5.5A Switches
PDF  8 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  E-CMOS [E-CMOS Corporation]
Direct Link  http://www.ecmos.com.tw/
Logo E-CMOS - E-CMOS Corporation

EC3689 Datasheet(HTML) 7 Page - E-CMOS Corporation

  EC3689 Datasheet HTML 1Page - E-CMOS Corporation EC3689 Datasheet HTML 2Page - E-CMOS Corporation EC3689 Datasheet HTML 3Page - E-CMOS Corporation EC3689 Datasheet HTML 4Page - E-CMOS Corporation EC3689 Datasheet HTML 5Page - E-CMOS Corporation EC3689 Datasheet HTML 6Page - E-CMOS Corporation EC3689 Datasheet HTML 7Page - E-CMOS Corporation EC3689 Datasheet HTML 8Page - E-CMOS Corporation  
Zoom Inzoom in Zoom Outzoom out
 7 / 8 page
background image
E-CMOS Corp. (www.ecmos.com.tw)
Page 7 of 8
4E02N-Rev.P001
800KHz Synchronous Step-up
Converter with 5.5A Switches
EC3689
Output Capacitor
The output capacitor must completely supply the load during the charging phase of the inductor. A reasonable value
of the output capacitance depends on the speed of the load transients and the load current during the load change.
It is recommended to use X7R ceramic capacitors placed as close as possible to the VOUT and PGND pins of the
IC. A recommended output capacitance value is around 20~100µ F. Note that high capacitance ceramic capacitors
have a DC Bias effect, which will have a strong influence on the final effective capacitance. A 10 V rated 0805
capacitor with 10µ F can have an effective capacitance of less 5µF at an output voltage of 5V.
Layout consideration
Use wide and short traces for the main current path and for the power ground tracks. The input capacitor, output
capacitor, and the inductor should be placed as close as possible to the IC. Use a common ground node for power
ground and a different one for analog ground to minimize the effects of ground noise. Connect these ground nodes
at any place close to the ground pins of the IC.
Thermal information
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special
attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks
and convection surfaces, and the presence of other heat-generating components affect the power-dissipation limits
of a given component.
Three basic approaches for enhancing thermal performance are listed below:
● Improving the power dissipation capability of the PCB design
● Improving the thermal coupling of the component to the PCB
● Introducing airflow in the system
The maximum junction temperature (TJ) of the EC3689 devices is 125℃.The thermal resistance of the SOP8
(Exposed PAD) package is RθJA = 38.2℃/W, if the Exposed PAD is soldered. Specified regulator operation is
assured to a maximum ambient temperature TA of +50℃. Therefore, the maximum power dissipation for the
SOP8(Exposed PAD) package it is about 1.96W. More power can be dissipated if the maximum ambient
temperature of the application is lower.



Html Pages

1 2 3 4 5 6 7 8


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com