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EC3689 Datasheet(PDF) 7 Page - E-CMOS Corporation |
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EC3689 Datasheet(HTML) 7 Page - E-CMOS Corporation |
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7 / 8 page ![]() E-CMOS Corp. (www.ecmos.com.tw) Page 7 of 8 4E02N-Rev.P001 800KHz Synchronous Step-up Converter with 5.5A Switches EC3689 Output Capacitor The output capacitor must completely supply the load during the charging phase of the inductor. A reasonable value of the output capacitance depends on the speed of the load transients and the load current during the load change. It is recommended to use X7R ceramic capacitors placed as close as possible to the VOUT and PGND pins of the IC. A recommended output capacitance value is around 20~100µ F. Note that high capacitance ceramic capacitors have a DC Bias effect, which will have a strong influence on the final effective capacitance. A 10 V rated 0805 capacitor with 10µ F can have an effective capacitance of less 5µF at an output voltage of 5V. Layout consideration Use wide and short traces for the main current path and for the power ground tracks. The input capacitor, output capacitor, and the inductor should be placed as close as possible to the IC. Use a common ground node for power ground and a different one for analog ground to minimize the effects of ground noise. Connect these ground nodes at any place close to the ground pins of the IC. Thermal information Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-dissipation limits of a given component. Three basic approaches for enhancing thermal performance are listed below: ● Improving the power dissipation capability of the PCB design ● Improving the thermal coupling of the component to the PCB ● Introducing airflow in the system The maximum junction temperature (TJ) of the EC3689 devices is 125℃.The thermal resistance of the SOP8 (Exposed PAD) package is RθJA = 38.2℃/W, if the Exposed PAD is soldered. Specified regulator operation is assured to a maximum ambient temperature TA of +50℃. Therefore, the maximum power dissipation for the SOP8(Exposed PAD) package it is about 1.96W. More power can be dissipated if the maximum ambient temperature of the application is lower. |
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