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MSP430A005IPWR Datasheet(PDF) 29 Page - Texas Instruments |
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MSP430A005IPWR Datasheet(HTML) 29 Page - Texas Instruments |
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29 / 47 page ![]() MSP430x11x2, MSP430x12x2 MIXED SIGNAL MICROCONTROLLER SLAS361D − JANUARY 2002 − REVISED AUGUST 2004 29 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 electrical characteristics over recommended operating free-air temperature (unless otherwise noted) (continued) Flash Memory PARAMETER TEST CONDITIONS VCC MIN NOM MAX UNIT VCC(PGM/ ERASE) Program and Erase supply voltage 2.7 3.6 V fFTG Flash Timing Generator frequency 257 476 kHz IPGM Supply current from VCC during program 2.7 V/ 3.6 V 3 5 mA IERASE Supply current from VCC during erase 2.7 V/ 3.6 V 3 7 mA tCPT Cumulative program time see Note 1 2.7 V/ 3.6 V 4 ms tCMErase Cumulative mass erase time see Note 2 2.7 V/ 3.6 V 200 ms Program/Erase endurance 104 105 cycles tRetention Data retention duration TJ = 25°C 100 years tWord Word or byte program time 35 tBlock, 0 Block program time for 1st byte or word 30 tBlock, 1-63 Block program time for each additional byte or word 21 tBlock, End Block program end-sequence wait time see Note 3 6 tFTG tMass Erase Mass erase time 5297 tSeg Erase Segment erase time 4819 NOTES: 1. The cumulative program time must not be exceeded when writing to a 64-byte flash block. This parameter applies to all programming methods: individual word/byte write and block write modes. 2. The mass erase duration generated by the flash timing generator is at least 11.1ms ( = 5297x1/fFTG,max = 5297x1/476kHz). To achieve the required cumulative mass erase time the Flash Controller’s mass erase operation can be repeated until this time is met. (A worst case minimum of 19 cycles are required). 3. These values are hardwired into the Flash Controller’s state machine; tFTG = 1/fFTG. JTAG Interface PARAMETER TEST CONDITIONS VCC MIN NOM MAX UNIT 2.2 V 0 5 MHz fTCK TCK input frequency see Note 1 3 V 0 10 MHz RInternal Internal pull-down resistance on TEST see Note 2 2.2 V/ 3 V 25 60 90 k Ω NOTES: 1. fTCK may be restricted to meet the timing requirements of the module selected. 2. TEST pull-down resistor implemented in all Flash versions. JTAG Fuse (see Note 1) PARAMETER TEST CONDITIONS VCC MIN NOM MAX UNIT VCC(FB) Supply voltage during fuse-blow condition TA = 25°C 2.5 V VFB Voltage level on TEST for fuse-blow 6 7 V IFB Supply current into TEST during fuse blow 100 mA tFB Time to blow fuse 1 ms NOTES: 1. Once the fuse is blown, no further access to the MSP430 JTAG/Test and emulation features is possible. The JTAG block is switched to bypass mode. |
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