© 2006 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FMS6151 • Rev. 1.0.6

8

Physical Dimensions

Figure 11. 6-Lead MicroPak™ Package

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,

specifically the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/.

2. DIM E NS IO NS A R E IN M ILLIM E TE R S

1. C O N FO R M S TO JE D E C S TA N D A R D M 0-252 V A R IA TIO N U A A D

4. FILE NA M E A N D RE V IS IO N : M A C06A RE V 4

Notes:

3. DRA W IN G CO NFO R M S TO A S M E Y 14.5M -1994

TO P VIEW

RE CO M M E N E D

LA N D P A TTE R N

BO TTO M VIEW

1.45

1.00

A

B

0.05 C

0.05 C

2X

2X

0.55M A X

0.05 C

(0.49)

(1)

(0.75)

(0.52)

(0.30)

6X

1X

6X

PIN 1

D E TA IL A

0.075 X 45

CHA M FE R

0.25

0.15

0.35

0.25

0.40

0.30

0.5

(0.05)

1.0

5X

D E TA IL A

PIN 1 TE R M IN AL

0.40

0.30

0.45

0.35

0.10

0.00

0.10

C B A

0.05

C

C

0.05 C

0.05

0.00

5X

5X

6X

(0.13)

4X

6X

PIN 1 ID EN TIFIER

(0.254)

5. PIN O N E ID EN TIFIER IS 2X LE N G TH O F AN Y

5

O THE R LINE IN TH E M A RK CO DE LA Y O UT.