| Electronic Components Datasheet Search |
|
LM76002 Datasheet(PDF) 49 Page - Texas Instruments |
|
|
|
|||||||||||||||||||||||||||||
LM76002 Datasheet(HTML) 49 Page - Texas Instruments |
|
49 / 54 page ![]() www.ti.com PACKAGE OUTLINE C A A 30X 0.3 0.2 1.8±0.1 22X 0.65 0.45 0.8 MAX (0.2) TYP 0.05 0.00 26X 0.5 2X 5 4.5±0.1 2X 1.5 8X 0.5 0.3 A 4.1 3.9 B 6.1 5.9 (0.08) (0.05) WQFN - 0.8 mm max height RNP0030B PLASTIC QUAD FLATPACK - NO LEAD 4222784/A 02/2016 PIN 1 INDEX AREA SEATING PLANE 0.08 C 1 11 16 26 12 15 30 27 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 C EXPOSED THERMAL PAD SYMM SYMM 31 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 2.700 SCALE 25.000 SECTION A-A SECTION A-A TYPICAL 49 LM76002-Q1, LM76003-Q1 www.ti.com SNVSAU3 – DECEMBER 2017 Product Folder Links: LM76002-Q1 LM76003-Q1 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |