23

LT1941

1941f

PACKAGE DESCRIPTIO

FE Package

28-Lead Plastic TSSOP (4.4mm)

(Reference LTC DWG # 05-08-1663)

Exposed Pad Variation EB

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

FE28 (EB) TSSOP 0204

0.09 – 0.20

(.0035 – .0079)

0

° – 8°

0.25

REF

0.50 – 0.75

(.020 – .030)

4.30 – 4.50*

(.169 – .177)

13

4

5

6 7 89 10 11 12 13 14

19

20

22 21

15

16

18 17

9.60 – 9.80*

(.378 – .386)

4.75

(.187)

2.74

(.108)

28 2726 25 24 23

1.20

(.047)

MAX

0.05 – 0.15

(.002 – .006)

0.65

(.0256)

BSC

0.195 – 0.30

(.0077 – .0118)

TYP

2

RECOMMENDED SOLDER PAD LAYOUT

EXPOSED

PAD HEAT SINK

ON BOTTOM OF

PACKAGE

0.45

±0.05

0.65 BSC

4.50

±0.10

6.60

±0.10

1.05

±0.10

4.75

(.187)

2.74

(.108)

MILLIMETERS

(INCHES)

*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.150mm (.006") PER SIDE

NOTE:

1. CONTROLLING DIMENSION: MILLIMETERS

2. DIMENSIONS ARE IN

3. DRAWING NOT TO SCALE

SEE NOTE 4

4. RECOMMENDED MINIMUM PCB METAL SIZE

FOR EXPOSED PAD ATTACHMENT

6.40

(.252)

BSC