S93WD462 datasheet(7/14 Pages) SUMMIT

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S93WD462/S93WD463

2029

2.2 1/23/01

SUMMIT MICROELECTRONICS, Inc.

ABSOLUTE MAXIMUM RATINGS*

Temperature Under Bias .................................................................................................................................... –55°C to +125°C

Storage Temperature ......................................................................................................................................... –65°C to +150°C

Voltage on any Pin with Respect to Ground(1) ............................................................................................. –2.0V to +VCC +2.0V

VCC with Respect to Ground .................................................................................................................................. –2.0V to +7.0V

Package Power Dissipation Capability (Ta = 25°C) ............................................................................................................. 1.0W

Lead Soldering Temperature (10 secs) .............................................................................................................................. 300°C

Output Short Circuit Current(2) ........................................................................................................................................... 100 mA

*COMMENT

Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions outside of those listed in the operational sections of this specification is not implied. Exposure to

any absolute maximum rating for extended periods may affect device performance and reliability.

Note:

(1) The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC

voltage on output pins is VCC +0.5V, which may overshoot to VCC +2.0V for periods of less than 20 ns.

(2) Output shorted for no more than one second. No more than one output shorted at a time.

(3) This parameter is tested initially and after a design or process change that affects the parameter.

(4) Latch-up protection is provided for stresses up to 100 mA on address and data pins from –1V to VCC +1V.

D.C. OPERATING CHARACTERISTICS (over recommended operating conditions unless otherwise specified)

Limits

Symbol

Parameter

Min.

Typ.

Max.

Units

Test Conditions

ICC

Power Supply Current

DI = 0.0V, fSK = 1MHz

(Operating)

VCC = 5.0V, CS = 5.0V,

Output Open

ISB

Power Supply Current

µA

CS = 0V

(Standby)

Reset Outputs Open

ILI

Input Leakage Current

µA

VIN = 0V to VCC

ILO

Output Leakage Current

µA

VOUT = 0V to VCC,

(Including ORG pin)

CS = 0V

VIL1

Input Low Voltage

-0.1

0.8

4.5V-VCC<5.5V

VIH1

Input High Voltage

VCC+1

VIL2

Input Low Voltage

VCCX0.2

1.8V-VCC<2.7V

VIH2

Input High Voltage

VCCX0.7

VCC+1

VOL1

Output Low Voltage

0.4

4.5V-VCC<5.5V

VOH1

Output High Voltage

2.4

IOL = 2.1mA

IOH = -400µA

VOL2

Output Low Voltage

0.2

1.8V-VCC<2.7V

VOH2

Output High Voltage

VCC-0.2

IOL = 1mA

IOH = -100µA

2029 PGM T3.0

RELIABILITY CHARACTERISTICS

Symbol

Parameter

Min.

Max.

Units

Reference Test Method

NEND(3)

Endurance

100,000

Cycles/Byte

MIL-STD-883, Test Method 1033

TDR(3)

Data Retention

100

Years

MIL-STD-883, Test Method 1008

VZAP(3)

ESD Susceptibility

2000

Volts

MIL-STD-883, Test Method 3015

ILTH(3)(4)

Latch-Up

100

JEDEC Standard 17

2029 PGM T2.1

Temperature

Min

Max

Commercial

0°C

+70°C

Industrial

-40°C

+85°C

RECOMMENDED OPERATING CONDITIONS

2029 PGM T7.0

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