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S70FL01GS Datasheet(PDF) 1 Page - Cypress Semiconductor

Part # S70FL01GS
Description  1 Gbit (128 Mbyte) 3.0V SPI Flash
PDF  19 Pages
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

S70FL01GS Datasheet(HTML) 1 Page - Cypress Semiconductor

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S70FL01GS
1 Gbit (128 Mbyte) 3.0V SPI Flash
Cypress Semiconductor Corporation
198 Champion Court
San Jose
, CA 95134-1709
408-943-2600
Document Number: 001-98295 Rev. *M
Revised June 23, 2017
Features
 CMOS 3.0V Core
 Serial Peripheral Interface (SPI) with Multi-I/O
– SPI Clock polarity and phase modes 0 and 3
– Double Data Rate (DDR) option
– Extended Addressing: 32-bit address
– Serial Command set and footprint compatible with
S25FL-A, S25FL-K, and S25FL-P SPI families
– Multi I/O Command set and footprint compatible with
S25FL-P SPI family
 READ Commands
– Normal, Fast, Dual, Quad, Fast DDR, Dual DDR, Quad
DDR
– AutoBoot – power up or reset and execute a Normal or
Quad read command automatically at a preselected
address
– Common Flash Interface (CFI) data for configuration
information
 Programming (1.5 Mbytes/s)
– 512-byte Page Programming buffer
– Quad-Input Page Programming (QPP) for slow clock
systems
 Erase (0.5 Mbytes/s)
– Uniform 256-kbyte sectors
 Cycling Endurance
– 100,000 Program-Erase Cycles, minimum
 Data Retention
– 20 Year Data Retention, minimum
Security Features
 One Time Program (OTP) array of 2048 bytes
 Block Protection
– Status Register bits to control protection against program
or erase of a contiguous range of sectors.
– Hardware and software control options
– Advanced Sector Protection (ASP)
– Individual sector protection controlled by boot code or
password
 Cypress® 65 nm MirrorBit® Technology with Eclipse
Architecture
 Core Supply Voltage: 2.7V to 3.6V
 I/O Supply Voltage: 1.65V to 3.6V
 Temperature Range / Grade:
– Industrial (
40 °C to +85 °C)
– Industrial Plus (
40 °C to +105 °C)
– Automotive, AEC-Q100 Grade 3 (
40 °C to +85 °C)
– Automotive, AEC-Q100 Grade 2 (
40 °C to +105 °C)
– Automotive, AEC-Q100 Grade 1 (
40 °C to +125 °C)
 Packages (all Pb-free)
– 16-lead SOIC (300 mils)
– BGA-24, 8
 6 mm
–5
 5 ball (ZSA024) footprint
General Description
This document contains information for the S70FL01GS device, which is a dual die stack of two S25FL512S die. For detailed
specifications, refer to the discrete die datasheet provided in the Affected Documents/Related Documents table.
Affected Documents/Related Documents
Document Title
Publication Number
S25FL512S 512 Mbit (64 Mbyte) 3.0V SPI Flash Memory Datasheet
001-98284


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