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TPS25221

SLVSDT3 – JANUARY 2018

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Copyright © 2018, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Voltage range on IN, OUT, EN, FAULT,ILIM

–0.3

6

V

Voltage range from IN to OUT

–6

6

Continuous FAULT sink current

0

25

mA

ILIM source current

0

1

mA

Internally Limited

TBD

TBD

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

(3)

Surges per EN61000-4-2. 1999 applied to output terminals of EVM. These are passing tests levels, not failure threshold.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-

±500

V

±8000

V

±15000

V

7.3 Recommended Operating Conditions

Voltages are respect to GND (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

IN

2.5

5.5

V

Input voltage

EN

0

5.5

V

High-level input voltage

EN

1.7

V

Low-level input voltage

EN

0.66

V

Output continuous current

OUT

0

2

A

Current-limit threshold resistor range (nominal 1%) from ILIM to GND

20

210

kΩ

Sink current into FAULT

FAULT

0

10

mA

Operating junction temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

TPS25221

UNIT

DBV (SOT-23)

DRV (WSON)

6-PIN

6-PIN

Junction-to-ambient thermal resistance

167.8

72

°C/W

Junction-to-case (top) thermal resistance

104.8

85.3

°C/W

Junction-to-board thermal resistance

47

41.3

°C/W

Junction-to-top characterization parameter

31.4

1.7

°C/W

Junction-to-board characterization parameter

47

41.7

°C/W

Junction-to-case (bottom) thermal resistance

--

11.1

°C/W