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VSC7182 Datasheet(PDF) 16 Page - Vitesse Semiconductor Corporation

Part # VSC7182
Description  Quad Transceiver for Gigabit Ethernet and Fibre Channel
PDF  18 Pages
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Manufacturer  VITESSE [Vitesse Semiconductor Corporation]
Direct Link  http://www.vitesse.com
Logo VITESSE - Vitesse Semiconductor Corporation

VSC7182 Datasheet(HTML) 16 Page - Vitesse Semiconductor Corporation

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VITESSE
SEMICONDUCTOR CORPORATION
®
Advance Product Information
VSC7182
Quad Transceiver
for Gigabit Ethernet and Fibre Channel
Page 16
G52307-0, Rev 2.2
10/10/00
© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012
Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com
Internet: www.vitesse.com
Package Thermal Characteristics
The VSC7182 is packaged in a 23mm BGA package with 1.27mm eutectic ball spacing. The construction
of the package is shown in Figure 6.
Figure 6: Package Cross Section
The VSC7182 is designed to operate with a case temperature up to 100oC. In order to comply with this tar-
get, the user must guarantee that the case temperature specification of 100oC is not violated. With the thermal
resistances shown in Table 8, the VSC7182 can operate in still air ambient temperatures of 40oC [40oC =
100oC - 2.5W * 24oC/W]. If the ambient air temperature exceeds these limits, some form of cooling through a
heatsink or an increase in airflow must be provided.
Table 8: Thermal Resistance
Moisture Sensitivity Level
This device is rated at with a Moisture Sensitivity Level 3 rating. Refer to Application Note AN-20 for
appropriate handling procedures.
Symbol
Description
Value
Units
θ
jc
Thermal resistance from junction-to-case
4.3
oC/W
θ
ca
Thermal resistance from case-to-ambient in still air including conduction
through the leads.
24
oC/W
θ
ca-100
Thermal resistance from case-to-ambient with 100 LFM airflow
21
oC/W
θ
ca-200
Thermal resistance from case-to-ambient with200 LFM airflow
18.5
oC/W
θ
ca-400
Thermal resistance from case-to-ambient with 400 LFM airflow
17
oC/W
θ
ca-600
Thermal resistance from case-to-ambient with 600 LFM airflow
15
oC/W
Die
Adhesive
Copper Heat Spreader
Encapsulant
Eutectic Solder Balls
Wirebond
Polyimide Dielectric
Die Attach Epoxy



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