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VSC7182 Datasheet(PDF) 16 Page - Vitesse Semiconductor Corporation |
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VSC7182 Datasheet(HTML) 16 Page - Vitesse Semiconductor Corporation |
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16 / 18 page ![]() VITESSE SEMICONDUCTOR CORPORATION ® Advance Product Information VSC7182 Quad Transceiver for Gigabit Ethernet and Fibre Channel Page 16 G52307-0, Rev 2.2 10/10/00 © VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012 Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com Internet: www.vitesse.com Package Thermal Characteristics The VSC7182 is packaged in a 23mm BGA package with 1.27mm eutectic ball spacing. The construction of the package is shown in Figure 6. Figure 6: Package Cross Section The VSC7182 is designed to operate with a case temperature up to 100oC. In order to comply with this tar- get, the user must guarantee that the case temperature specification of 100oC is not violated. With the thermal resistances shown in Table 8, the VSC7182 can operate in still air ambient temperatures of 40oC [40oC = 100oC - 2.5W * 24oC/W]. If the ambient air temperature exceeds these limits, some form of cooling through a heatsink or an increase in airflow must be provided. Table 8: Thermal Resistance Moisture Sensitivity Level This device is rated at with a Moisture Sensitivity Level 3 rating. Refer to Application Note AN-20 for appropriate handling procedures. Symbol Description Value Units θ jc Thermal resistance from junction-to-case 4.3 oC/W θ ca Thermal resistance from case-to-ambient in still air including conduction through the leads. 24 oC/W θ ca-100 Thermal resistance from case-to-ambient with 100 LFM airflow 21 oC/W θ ca-200 Thermal resistance from case-to-ambient with200 LFM airflow 18.5 oC/W θ ca-400 Thermal resistance from case-to-ambient with 400 LFM airflow 17 oC/W θ ca-600 Thermal resistance from case-to-ambient with 600 LFM airflow 15 oC/W Die Adhesive Copper Heat Spreader Encapsulant Eutectic Solder Balls Wirebond Polyimide Dielectric Die Attach Epoxy |
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