Rev 0.90

Page 7 of 44

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PRELIMINARY

Table 9. Absolute Maximum

Attempted operation outside the absolute maximum ratings of the part may cause permanent damage to the part.

Actual performance of the IC is only guaranteed within the operational specifications, not at absolute maximum ratings.

Parameter

Test Conditions

Value

Unit

Storage Temperature

-65 to 125

°C

Continuous Power Supply Voltage Range (Vdd)

-0.5 to 4

V

Human Body Model (HBM) ESD Protection

JESD22-A114

–

V

Soldering Temperature (follow standard Pb-free soldering guidelines)

260

°C

Junction Temperature[5]

130

°C

Note:

5. Exceeding this temperature for an extended period of time may damage the device.

Table 10. Thermal Consideration[6]

Package

5032, 10-pin

TBD

TBD

Note:

6. Refer to JESD51 for

θJA and θJC definitions, and reference layout used to determine the θJA and θJC values in the above table.

Table 11. Maximum Operating Junction Temperature[7]

Max Operating Temperature(ambient)

Maximum Operating Junction Temperature

70°C

80

85°C

95

Note:

7. Datasheet specifications are not guaranteed if junction temperature exceeds the maximum operating junction temperature.

Table 12. Environmental Compliance

Parameter

Test Conditions

Value

Unit

Mechanical Shock Resistance

MIL-STD-883F, Method 2002

20000

g

Mechanical Vibration Resistance

MIL-STD-883F, Method 2007

70

g

Temperature Cycle

JESD22, Method A104

–

–

Solderability

MIL-STD-883F, Method 2003

–

–

Moisture Sensitivity Level

MSL1 @260°C

–

–