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MPQ6526 Datasheet(PDF) 4 Page - Monolithic Power Systems |
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MPQ6526 Datasheet(HTML) 4 Page - Monolithic Power Systems |
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4 / 19 page ![]() MPQ6526 – HEX HALF-BRIDGE MOTOR DRIVER WITH SERIAL INPUT CONTROL MPQ6526 Rev. 1.0 www.MonolithicPower.com 4 2/6/2017 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2017 MPS. All Rights Reserved. PACKAGE REFERENCE TOP VIEW TOP VIEW QFN-24 (4mmx4mm) QFN-24 (5mmx5mm) ABSOLUTE MAXIMUM RATINGS (1) Supply voltage (VVS) ....................................40V VOUTx ...................................... -0.3 to VVS + 0.3V Logic supply voltage (VVCC)............-0.3 to +6.5V Logic input voltage............... -0.3 to VVCC + 0.3V Logic output voltage............. -0.3 to VVCC + 0.3V Voltage at all other pins .................-0.3 to +6.5V Continuous power dissipation (TA = +25°C) (2) QFN-24 (4mmx4mm) ....................................3W QFN-24 (5mmx5mm) .................................3.5W Junction temperature ............................... 150°C Lead temperature .................................... 260°C Storage temperature.................. -60°C to 150°C ESD Susceptibility (3) Human body mode (HBM) ...........................2kV Machine mode (MM) ..................................200V Charge device model (CDM)......................750V Recommended Operating Conditions (4) Supply voltage (VVS) .......................... 7V to 28V Logic supply voltage (VVCC)........ 4.75V to 5.25V Operating junction temp. (TJ) ... -40°C to +150°C Thermal Resistance (5) θJA θJC QFN-24 (4mmx4mm) ............ 42........ 9 .... °C/W QFN-24 (5mmx5mm) ............ 36........ 8 .... °C/W NOTES: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θ JA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation produces an excessive die temperature, causing the regulator to go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) Devices are ESD-sensitive. Handling precaution is recommended. 4) The device is not guaranteed to function outside of its operating conditions. 5) Measured on JESD51-7, 4-layer PCB. |
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