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LTC4359 Datasheet(PDF) 8 Page - Linear Technology |
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LTC4359 Datasheet(HTML) 8 Page - Linear Technology |
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8 / 20 page ![]() LTC4359 8 Rev D For more information www.analog.com APPLICATIONS INFORMATION The MOSFET’s on-resistance, RDS(ON), directly affects the forward voltage drop and power dissipation. Desired forward voltage drop should be less than that of a diode for reduced power dissipation; 100mV is a good starting point. Choose a MOSFET which has: RDS(ON) < Forward Voltage Drop ILOAD The resulting power dissipation is Pd = (ILOAD)2 • RDS(ON) Shutdown Mode In shutdown, the LTC4359 pulls GATE low to SOURCE, turningofftheMOSFETandreducingitscurrentconsump- tion to 9µA. Shutdown does not interrupt forward current flow, a path is still present through Q1’s body diode, as shown in Figure 1. A second MOSFET is needed to block the forward path; see the section Load Switching and Inrush Control. When enabled the LTC4359 operates as an ideal diode. If shutdown is not needed, connect SHDN to IN. SHDN may be driven with a 3.3V or 5V logic sig- nal, or with an open drain or collector. To assert SHDN low, the pull down must sink at least 5µA at 500mV. To enable the part, SHDN must be pulled up to at least 2V. If SHDN is driven with an open drain, open collector or switch contact, an internal pull-up current of 2.6µA (1µA minimum) asserts SHDN high and enables the LTC4359. If leakage from SHDN to ground cannot be maintained at less than 100nA, add a pull-up resistor to >2V to assure turn on. The self-driven open circuit voltage is limited internally to 2.5V. When floating, the impedance is high and SHDN is subject to capacitive coupling from nearby clock lines or traces exhibiting high dV/dt. Bypass SHDN to VSS with 10nF to eliminate injection. Figure 3a is the simplestwaytocontroltheshutdownpin.Sincethecontrol signal ground is different from the SHDN pin reference, VSS, there could be momentary glitches on SHDN during transients. Figures 3b and 3c are alternative solutions that level-shift the control signal and eliminate glitches. Figure 3a. SHDN Control Figure 3b. Transistor SHDN Control Figure 4c. Opto-Isolator SHDN Control 4359 F03a LTC4359 1k VN2222LL VSS SHDN OFF ON 4359 F03b LTC4359 1k 240k 100k 100k 240k 48V 2N5551 VSS SHDN IN ON OFF 2N5401 4359 F03c LTC4359 1k 2M 1M MOC 207M 2k 48V VSS SHDN IN OFF ON Input Short-Circuit Faults The dynamic behavior of an active, ideal diode entering reverse bias is most accurately characterized by a delay followed by a period of reverse recovery. During the delay phase some reverse current is built up, limited by parasitic resistances and inductances. During the reverse recovery |
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