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MP5610 Datasheet(PDF) 2 Page - Monolithic Power Systems |
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MP5610 Datasheet(HTML) 2 Page - Monolithic Power Systems |
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2 / 15 page ![]() MP5610 – 2.7V TO 5.5V INPUT, 1.2MH z, DUAL-CH, LCD BIAS POWER SUPPLY MP5610 Rev. 1.02 www.MonolithicPower.com 2 12/6/2016 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2016 MPS. All Rights Reserved. ORDERING INFORMATION Part Number* Package Top Marking MP5610GQG QFN-10 (1.4mm×1.8mm) BZ * For Tape & Reel, add suffix –Z (e.g. MP5610GQG–Z); PACKAGE REFERENCE TOP VIEW 1 2 3 5 4 6 7 8 10 9 VON SW VINP VOP GND EN FBP CP2 CP1 VIN QFN-10 (1.4mm×1.8mm) ABSOLUTE MAXIMUM RATINGS (1) VIN, VINP ....................................... -0.3V to +6.5V VSW, VOP, VCP1…………………..…-0.3V to +7V VCP2, VON........................................ -7V to +0.3V All Other Pins.............................. -0.3V to +6.5V Junction Temperature .............................. 150°C Lead Temperature ................................... 260°C Continuous Power Dissipation ... (TA = 25°C) (2) QFN-10 (1.4mm×1.8mm)......................0.892W Recommended Operating Conditions (3) Supply Voltage VIN ......................... 2.7V to 5.5V Operating Junction Temp......... -40°C to +125°C Thermal Resistance (4) θJA θJC QFN-10 (1.4mm×1.8mm) ..... 140...... 30 °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θ JA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. |
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