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ADS1602IPFBT Datasheet(PDF) 2 Page - Burr-Brown (TI) |
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ADS1602IPFBT Datasheet(HTML) 2 Page - Burr-Brown (TI) |
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2 / 26 page ![]() ADS1602 SBAS341B − DECEMBER 2004 − REVISED APRIL 2005 www.ti.com 2 PACKAGE/ORDERING INFORMATION For the most current package and ordering information see the Package Option Addendum located at the end of this datasheet or visit the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) ADS1602 UNIT AVDD to AGND −0.3 to +6 V DVDD to DGND −0.3 to +3.6 V IOVDD to DGND −0.3 to +6 V AGND to DGND −0.3 to +0.3 V Input Current 100mA, Momentary Input Current 10mA, Continuous Analog I/O to AGND −0.3 to AVDD + 0.3 V Digital I/O to DGND −0.3 to IOVDD + 0.3 V Maximum Junction Temperature +150 °C Operating Temperature Range −40 to +105 °C Storage Temperature Range −60 to +150 °C Lead Temperature (soldering, 10s) +260 °C (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ADS1602 passes standard 200V machine model and 1.5K CDM testing. ADS1602 passes 1kV human body model testing (TI Standard is 2kV). ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |
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