LT8705 datasheet(32/44 Pages) LINER

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LTC7812

7812fc

For more information www.linear.com/LTC7812

4. Is the INTVCC decoupling capacitor connected close

to the IC, between the INTVCC and the power ground

pins? This capacitor carries the MOSFET drivers’ cur-

rent peaks. An additional 1µF ceramic capacitor placed

immediately next to the INTVCCandPGNDpinscanhelp

improve noise performance substantially.

5. Keep the switching nodes (SW1, SW2), top gate nodes

(TG1, TG2), and boost nodes (BOOST1, BOOST2) away

from sensitive small-signal nodes, especially from

the opposites channel’s voltage and current sensing

feedback pins. All of these nodes have very large and

fast moving signals and therefore should be kept on

the output side of the LTC7812 and occupy minimum

PC trace area.

6. Useamodifiedstargroundtechnique:alowimpedance,

large copper area central grounding point on the same

side of the PC board as the input and output capacitors

with tie-ins for the bottom of the INTVCC decoupling

capacitor, the bottom of the voltage feedback resistive

divider and the SGND pins of the IC.

PC Board Layout Debugging

Start with one controller on at a time. It is helpful to use

a DC-50MHz current probe to monitor the current in the

inductorwhiletestingthecircuit.Monitortheoutputswitch-

ing node (SW pin) to synchronize the oscilloscope to the

internal oscillator and probe the actual output voltage as

well. Check for proper performance over the operating

voltage and current range expected in the application.

The frequency of operation should be maintained over the

input voltage range down to dropout and until the output

load drops below the low current operation threshold—

typically 25% of the maximum designed current level in

Burst Mode operation.

Thedutycyclepercentageshouldbemaintainedfromcycle

tocycleinawell-designed,lownoisePCBimplementation.

Variation in the duty cycle at a subharmonic rate can sug-

gest noise pickup at the current or voltage sensing inputs

or inadequate loop compensation. Overcompensation of

the loop can be used to tame a poor PC layout if regulator

bandwidth optimization is not required. Only after each

controller is checked for its individual performance should

both controllers be turned on at the same time.

Reduce VIN from its nominal level to verify operation of

the regulator in dropout. Check the operation of the un-

dervoltage lockout circuit by further lowering VIN while

monitoring the outputs to verify operation.

Investigate whether any problems exist only at higher out-

put currents or only at higher input voltages. If problems

coincide with high input voltages and low output currents,

look for capacitive coupling between the BOOST, SW, TG,

and possibly BG connections and the sensitive voltage

and current pins. The capacitor placed across the current

sensing pins needs to be placed immediately adjacent to

the pins of the IC. This capacitor helps to minimize the

effects of differential noise injection due to high frequency

capacitive coupling. If problems are encountered with

high current output loading at lower input voltages, look

for inductive coupling between CIN, Schottky and the top

MOSFET components to the sensitive current and voltage

sensing traces. In addition, investigate common ground

path voltage pickup between these components and the

SGND pin of the IC.

An embarrassing problem, which can be missed in an

otherwise properly working switching regulator, results

when the current sensing leads are hooked up backwards.

The output voltage under this improper hookup will still

be maintained but the advantages of current mode control

will not be realized. Compensation of the voltage loop will

be much more sensitive to component selection. This

behavior can be investigated by temporarily shorting out

the current sensing resistor—don’t worry, the regulator

will still maintain control of the output voltage.

APPLICATIONS INFORMATION

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