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HC5513 Datasheet(PDF) 2 Page - Renesas Technology Corp |
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HC5513 Datasheet(HTML) 2 Page - Renesas Technology Corp |
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2 / 20 page  HC5513 FN3963 Rev.12.00 Page 2 of 20 August 2003 Absolute Maximum Ratings Thermal Information Operating Temperature Range . . . . . . . . . . . . . . . . -40oC to 110oC Power Supply (-40oC TA 85oC) Supply Voltage VCC to GND . . . . . . . . . . . . . . . . . . . . 0.5V to 7V Supply Voltage VEE to GND . . . . . . . . . . . . . . . . . . . . -7V to 0.5V Supply Voltage VBAT to GND . . . . . . . . . . . . . . . . . . -70V to 0.5V Ground Voltage between AGND and BGND. . . . . . . . . . . . . -0.3V to 0.3V Relay Driver Ring Relay Supply Voltage . . . . . . . . . . . . . . . . . . . . . . 0V to 20V Ring Relay Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA Ring Trip Comparator Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VBAT to 0V Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -5mA to 5mA Digital Inputs, Outputs (C1, C2, E0, E1, DET) Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0V to VCC Output Voltage (DET Not Active) . . . . . . . . . . . . . . . . . .0V to VCC Output Current (DET) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mA Tipx and Ringx Terminals (-40oC TA85oC) Tipx or Ringx Voltage, Continuous (Referenced to GND) VBAT to 2V Tipx or Ringx, Pulse < 10ms, TREP > 10s . . . . . VBAT -20V to 5V Tipx or Ringx, Pulse < 10 s, TREP > 10s . . . . VBAT -40V to 10V Tipx or Ringx, Pulse < 250ns, TREP > 10s . . . VBAT -70V to 15V Tipx or Ringx Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70mA ESD Rating Human Body Model (Per MIL-STD-883 Method 3015.7) . . . .500V Thermal Resistance (Typical, Note 1) JAoC/W 22 Lead PDIP Package . . . . . . . . . . . . . . . . . . . . . . 53 Continuous Dissipation at 70oC 22 Lead PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5W Package Power Dissipation at 70oC, t < 100ms, tREP > 1s 22 Lead PDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4W Derate above . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70oC Plastic DIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . 18.8mW/oC Maximum Junction Temperature Range . . . . . . . . . -40oC to 150oC Maximum Storage Temperature Range . . . . . . . . . -65oC to 150oC Die Characteristics Gate Count . . . . . . . . . . . . . . . . . . . . . . 543 Transistors, 51 Diodes CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. JA is measured with the component mounted on an evaluation PC board in free air. Typical Operating Conditions These represent the conditions under which the part was developed and are suggested as guidelines. PARAMETER CONDITIONS MIN TYP MAX UNITS Case Temperature -40 - 100 oC VCC with Respect to AGND -40oC to 85oC 4.75 - 5.25 V VEE with Respect to AGND -40oC to 85oC -5.25 - -4.75 V VBAT with Respect to BGND -40oC to 85oC -58 - -24 V Electrical Specifications TA = -40oC to 85oC, VCC = 5V 5%, VEE = -5V5%, VBAT = -28V, AGND = BGND = 0V, RDC1 = RDC2 = 41.2k , RD = 39k, RSG =, RF1 = RF2 = 0, CHP = 10nF, CDC = 1.5F, ZL = 600. PARAMETER CONDITIONS MIN TYP MAX UNITS Overload Level 1% THD, ZL = 600, (Note 2, Figure 1) 3.1 - - VPEAK Longitudinal Impedance (Tip/Ring) 0 < f < 100Hz (Note 3, Figure 2) - 20 35 /Wire FIGURE 1. OVERLOAD LEVEL (TWO-WIRE PORT) FIGURE 2. LONGITUDINAL IMPEDANCE TIP 5 VTX 21 RING 6 RSN 19 IDCMET RT RRX ERX RL VTRO 600k 300k 600 23mA EL VT C 0 < f < 100Hz VR LZT = VT/AT LZR = VR/AR 1VRMS 300 300 2.16 F TIP 5 VTX 21 RING 6 RSN 19 RT RRX 600k 300k AT AR |
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