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R03

CPC7595

3.5.3 CPC7595Mx 28-Pin DFN Package

NOTE: Because the metallic pad on the bottom of the DFN package is connected to the substrate of the die, IXYS

Integrated Circuits Division recommends that no printed circuit board traces cross this area to avoid potential shorting

issues.

3.6 Tape and Reel Specifications

3.6.1 CPC7595ZxTR Tape & Reel

Recommended PCB Land Pattern

Dimensions

mm

(inches)

7.0

(0.276)

11.0

(0.433)

7.5±0.05

(0.296±0.002)

5.0±0.05

(0.197±0.002)

0.75

(0.030)

0.33 +0.07,-0.05

(0.013 +0.003, -0.002)

0.55±0.10

(0.022±0.004)

Bottom side

metallic pad

Pin 1

0.90±0.10

(0.036 ±0.004)

0.02 +0.03, -0.02

(0.001 +0.0012, -0.001)

Seating Plane

0.20

(0.008)

Pin 1

6.70

(0.264)

0.75

(0.03)

0.35

(0.016)

1.05

(0.045)

Dimensions

mm

(inches)

NOTE: Unless otherwise specified, all dimension tolerances per EIA-481

Top Cover

Tape Thickness

0.102 MAX

(0.004 MAX)

330.2 DIA.

(13.00 DIA)

Embossed Carrier

Embossment

K

(0.126±0.006)

K

(0.10±0.006)

P=12.00

(0.47)

A

(0.42±0.006)

B

(0.53±0.006)

W=24.00±0.3

(0.94)