| Electronic Components Datasheet Search |
|
TMUX6119 Datasheet(PDF) 4 Page - Texas Instruments |
|
|
|
|||||||||||||||||||||||||||||
TMUX6119 Datasheet(HTML) 4 Page - Texas Instruments |
|
4 / 23 page ![]() 4 TMUX6119 SCDS384 – SEPTEMBER 2018 www.ti.com Product Folder Links: TMUX6119 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VDD to VSS Supply voltage 36 V VDD to GND –0.3 18 V VSS to GND –18 0.3 V VDIG Digital input pin (SEL, EN) voltage GND –0.3 VDD+0.3 V IDIG Digital input pin (SEL, EN) current –30 30 mA VANA_IN Analog input pin (Sx) voltage VSS–0.3 VDD+0.3 V IANA_IN Analog input pin (Sx) current –30 30 mA VANA_OUT Analog output pin (D) voltage VSS–0.3 VDD+0.3 V IANA_OUT Analog output pin (D) current –30 30 mA TA Ambient temperature –55 150 °C TJ Junction temperature 150 °C Tstg Storage temperature –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500 (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.3 Thermal Information THERMAL METRIC(1) TMUX6119 UNIT DCN (SOT-23) 8 PINS RθJA Junction-to-ambient thermal resistance 180.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 138.8 °C/W RθJB Junction-to-board thermal resistance 90.4 °C/W ΨJT Junction-to-top characterization parameter 73.7 °C/W ΨJB Junction-to-board characterization parameter 90.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W (1) When VSS = 0 V, VDD can range from 10 V to 36 V. 6.4 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD to VSS (1) Power supply voltage differential 10 33 V VDD to GND Positive power supply voltage (singlle supply, VSS = 0 V) 10 16.5 V VDD to GND Positive power supply voltage (dual supply) 5 16.5 V VSS to GND Negative power supply voltage (dual supply) –5 –16.5 V |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |