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TMUX6119 Datasheet(PDF) 4 Page - Texas Instruments

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Part # TMUX6119
Description  36-V, Low Capacitance, Low-Leakage-Current, Precision, SPDT Switches
PDF  23 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TMUX6119 Datasheet(HTML) 4 Page - Texas Instruments

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4
TMUX6119
SCDS384 – SEPTEMBER 2018
www.ti.com
Product Folder Links: TMUX6119
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VDD to VSS
Supply voltage
36
V
VDD to GND
–0.3
18
V
VSS to GND
–18
0.3
V
VDIG
Digital input pin (SEL, EN) voltage
GND –0.3
VDD+0.3
V
IDIG
Digital input pin (SEL, EN) current
–30
30
mA
VANA_IN
Analog input pin (Sx) voltage
VSS–0.3
VDD+0.3
V
IANA_IN
Analog input pin (Sx) current
–30
30
mA
VANA_OUT
Analog output pin (D) voltage
VSS–0.3
VDD+0.3
V
IANA_OUT
Analog output pin (D) current
–30
30
mA
TA
Ambient temperature
–55
150
°C
TJ
Junction temperature
150
°C
Tstg
Storage temperature
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per
ANSI/ESDA/JEDEC JS-001, all pins(1)
±2000
V
Charged device model (CDM), per JEDEC
specification JESD22-C101, all pins(2)
±500
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.3 Thermal Information
THERMAL METRIC(1)
TMUX6119
UNIT
DCN (SOT-23)
8 PINS
RθJA
Junction-to-ambient thermal resistance
180.5
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
138.8
°C/W
RθJB
Junction-to-board thermal resistance
90.4
°C/W
ΨJT
Junction-to-top characterization parameter
73.7
°C/W
ΨJB
Junction-to-board characterization parameter
90.5
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
°C/W
(1)
When VSS = 0 V, VDD can range from 10 V to 36 V.
6.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VDD to VSS
(1)
Power supply voltage differential
10
33
V
VDD to GND
Positive power supply voltage (singlle supply, VSS = 0 V)
10
16.5
V
VDD to GND
Positive power supply voltage (dual supply)
5
16.5
V
VSS to GND
Negative power supply voltage (dual supply)
–5
–16.5
V



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