¡ Semiconductor

ML2500

6/7

FEDL2500-01

PACKAGE DIMENSIONS

(Unit : mm)

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which

are very susceptible to heat in reflow mounting and humidity absorbed in storage.

Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the

product name, package name, pin number, package code and desired mounting conditions

(reflow method, temperature and times).

TSOP

I32-P-814-0.50-1K

Mirror finish

Package material

Lead frame material

Pin treatment

Package weight (g)

Oki Electric Industry Co., Ltd.

Rev. No./Last Revised

Epoxy resin

42 alloy

Solder plating (≥5 mm)

0.27 TYP.

3/Dec. 10, 1996