AD5752 datasheet(31/31 Pages) AD

31 / 31 page

Data Sheet

AD5722/AD5732/AD5752

Rev. F | Page 31 of 31

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-153-ADT

6.40 BSC

0.15

0.05

0.10 COPLANARITY

TOP VIEW

EXPOSED

PAD

(Pins Up)

BOTTOM VIEW

4.50

4.40

4.30

7.90

7.80

7.70

1.20 MAX

1.05

1.00

0.80

0.65

BSC

0.30

0.19

SEATING

PLANE

0.20

0.09

8°

0°

0.75

0.60

0.45

5.02

5.00

4.95

3.25

3.20

3.15

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 47. 24-Lead Thin Shrink Small Outline Package, Exposed Pad [TSSOP_EP]

(RE-24)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Resolution (Bits)

Temperature Range

INL

TUE (% FSR)

Package Description

Package Option

AD5722AREZ

−40°C to +85°C

±1 LSB

±0.3

24-Lead TSSOP_EP

RE-24

AD5722AREZ-REEL7

−40°C to +85°C

±1 LSB

±0.3

24-Lead TSSOP_EP

RE-24

AD5732AREZ

−40°C to +85°C

±4 LSB

±0.3

24-Lead TSSOP_EP

RE-24

AD5732AREZ-REEL7

−40°C to +85°C

±4 LSB

±0.3

24-Lead TSSOP_EP

RE-24

AD5752AREZ

−40°C to +85°C

±16 LSB

±0.3

24-Lead TSSOP_EP

RE-24

AD5752AREZ-REEL7

−40°C to +85°C

±16 LSB

±0.3

24-Lead TSSOP_EP

RE-24

1 Z = RoHS Compliant Part.

registered trademarks are the property of their respective owners.

D06467-0-2/17(F)

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