AP65550

Document number: DS36336 Rev. 5 - 2

12 of 16

www.diodes.com

January 2018

© Diodes Incorporated

AP65550

PC Board Layout

1.

The AP65550 works at 5A load current, heat dissipation is a major concern in layout the PCB. A 2oz Copper in both top and bottom

layer is recommended.

2.

Provide sufficient vias in the thermal exposed pad for heat dissipate to the bottom layer.

3.

Provide sufficient vias in the Output capacitor PGND side to dissipate heat to the bottom layer.

4.

Make the bottom layer under the device as PGND layer for heat dissipation. The PGND layer should be as large as possible to provide

better thermal effect.

5.

Make the Vin capacitors as close to the device as possible.

6.

Make the VREG5 capacitor as close to the device as possible.

7.

The thermal pad of the device should be soldered directly to the PCB exposed copper plane to work as a heatsink. The thermal vias in

the exposed copper plane increase the heat transfer to the bottom layer.

Figure 7 PC Board Layout for SO-8EP

Figure 8 PC Board Layout for U-DFN3030-10