HCPL-0723 datasheet(5/12 Pages) HP

5 / 12 page

Solder Reflow Temperature Profile

Regulatory Information

The HCPL-7723/0723 will be

approved by the following

organizations:

Recognized under UL1577,

component recognition program,

File E55361.

CSA

Approved under CSA Component

Acceptance Notice #5, File

CA88324.

VDE

(HCPL-7723 option 060)

Approved according to VDE

0884/06.92, File 6591-23-4880-

1005.

TUV Rheinland

(HCPL-0723 Option 060)

Approved according to VDE

0884/06.92, Certificate

R9650938.

Insulation and Safety Related Specifications

Value

Parameter

Symbol

7723

0723

Units

Conditions

Minimum External Air Gap

L(I01)

7.1

4.9

Measured from input terminals to output

(Clearance)

terminals, shortest distance through air.

Minimum External Tracking

L(I02)

7.4

4.8

Measured from input terminals to output

(Creepage)

terminals, shortest distance path along body.

Minimum Internal Plastic Gap

0.08

Insulation thickness between emitter and

(Internal Clearance)

detector; also known as distance through

insulation.

Tracking Resistance

CTI

≥ 175

Volts

DIN IEC 112/VDE 0303 Part 1

(Comparative Tracking Index)

Isolation Group

IIIa

Material Group (DIN VDE 0110, 1/89, Table 1)

TIME (SECONDS)

200

100

150

100

200

250

300

SEC.

50 SEC.

SEC.

160°C

140°C

150°C

PEAK

TEMP.

245°C

PEAK

TEMP.

240°C

PEAK

TEMP.

230°C

SOLDERING

TIME

200°C

PREHEATING TIME

150°C, 90 + 30 SEC.

2.5°C ± 0.5°C/SEC.

3°C + 1°C/–0.5°C

TIGHT

TYPICAL

LOOSE

ROOM

TEMPERATURE

PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.

REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.

HCPL-0723 Datasheet(PDF) 5 Page - Agilent(Hewlett-Packard)

HCPL-0723 Datasheet(HTML) 5 Page - Agilent(Hewlett-Packard)

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