HCPL-0723 datasheet(7/12 Pages) HP

7 / 12 page

Absolute Maximum Ratings

Parameter

Symbol

Min.

Max.

Units

Storage Temperature

–55

125

°C

Ambient Operating Temperature[1]

–40

°C

Supply Voltages

VDD1, VDD2

6.0

Volts

Input Voltage

–0.5

VDD1 +0.5

Volts

Output Voltage

–0.5

VDD2 +0.5

Volts

Average Output Current

Lead Solder Temperature

260

°C for 10 sec., 1.6 mm below seating plane

Solder Reflow Temperature Profile

See Solder Reflow Temperature Profile Section

Recommended Operating Conditions

Parameter

Symbol

Min.

Max.

Units

Ambient Operating Temperature

–40

°C

Supply Voltages

VDD1, VDD2

4.5

5.5

Logic High Input Voltage

VIH

2.0

VDD1

Logic Low Input Voltage

VIL

0.0

0.8

Input Signal Rise and Fall Times

tr, tf

1.0

Electrical Specifications

Test conditions that are not specified can be anywhere within the recommended operating range.

All typical specifications are at TA = +25

°C, VDD1 = VDD2 = +5 V.

Parameter

Symbol

Min.

Typ.

Max.

Units

Test Conditions

Logic Low Input Supply Current[2]

IDD1L

710

VI = 0 V

Logic High Input Supply Current[2]

IDD1H

1.8

VI = VDD1

Output Supply Current

IDD2L

12.5

17.5

IDD2H

16.5

Input Current

–10

µA

Logic High Output Voltage

VOH

4.4

5.0

IO = –20

µA, VI = VIH

4.0

4.8

IO = –4 mA, VI = VIH

Logic Low Output Voltage

VOL

0.1

IO = 20

µA, VI = VIL

0.5

1.0

IO = 4 mA, VI = VIL

HCPL-0723 Datasheet(PDF) 7 Page - Agilent(Hewlett-Packard)

HCPL-0723 Datasheet(HTML) 7 Page - Agilent(Hewlett-Packard)

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12

Datasheet Download

Link URL