AP6255 datasheet(29/34 Pages) ETC2

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AP6255(Industry) Datasheet

AMPAK Technology Inc.

www.ampak.com.tw

Proprietary & Confidential Information

Doc. NO:

Solder Paste definition



Module Specifications : W:0.65mm * L:0.95mm pitch 0.9 mm



The proposed design W:0.65~0.75 mm * L:1.33mm. Consider not place other parts in

the peripheral area of 1 mm ~ 1.5 mm to facilitate additional amount of solder for PCB

pad.



We Suggest the thickness of Stencil between 0.12 mm ~0.15mm, the W between

0.6~0.65mm and the L between L1.5~1.6mm.



If the thickness of the stencil is thinner, we suggest to adding more solder, to increase

the wetting ability. Depends on different production situation, if the stencil thickness is

0.08~0.1mm, and the module nearby area is no more space for expending soldering

area, we will suggest to increase the stencil thickness to increase the wetting ability.



The major consideration parts of stencil design is to increase the solder paste wetting

ability.



模組規格 W0.65mm *L0.95mm Pitch 0.9mm



PCB Pad建議設計 W0.65~0.75mm *L1.33mm，

且周邊1mm~1.5mm區域考慮不放置零件以利外

加錫量。



鋼網建議厚度為0.12mm~0.15mm，

W0.6~0.65mm* L1.5~1.6mm



因為模組需要側面爬錫，當鋼網厚度越薄外加錫量

需越多，需依實際生產狀態評估，當使用鋼網

0.08mm或 0.1mm且外加可能性低時則必須考慮

局部加厚鋼網的設計。



鋼網設計主要以增加爬錫的焊錫膏量考量。

AP6255 Datasheet(PDF) 29 Page - List of Unclassifed Manufacturers