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AM5728 Datasheet(PDF) 397 Page - Texas Instruments

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Part # AM5728
Description  Sitara Processors Silicon Revision 2.0
PDF  415 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

AM5728 Datasheet(HTML) 397 Page - Texas Instruments

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397
AM5729, AM5728, AM5726
www.ti.com
SPRS953F – DECEMBER 2015 – REVISED MAY 2019
Submit Documentation Feedback
Product Folder Links: AM5729 AM5728 AM5726
Applications, Implementation, and Layout
Copyright © 2015–2019, Texas Instruments Incorporated
Table 8-12. CK and ADDR_CTRL Routing Specification(2)(3)
NO.
PARAMETER
MIN
TYP
MAX
UNIT
CARS31
A1+A2 length
500(1)
ps
CARS32
A1+A2 skew
29
ps
CARS33
A3 length
125
ps
CARS34
A3 skew(4)
6
ps
CARS35
A3 skew(5)
6
ps
CARS36
A4 length
125
ps
CARS37
A4 skew
6
ps
CARS38
AS length
5(1)
17
ps
CARS39
AS skew
1.3(1)
14
ps
CARS310
AS+/AS- length
5
12
ps
CARS311
AS+/AS- skew
1
ps
CARS312
AT length(6)
75
ps
CARS313
AT skew(7)
14
ps
CARS314
AT skew(8)
1
ps
CARS315
CK/ADDR_CTRL trace length
1020
ps
CARS316
Vias per trace
3(1)
vias
CARS317
Via count difference
1(15)
vias
CARS318
Center-to-center CK to other DDR3 trace spacing(9)
4w
CARS319
Center-to-center ADDR_CTRL to other DDR3 trace spacing(9)(10)
4w
CARS320
Center-to-center ADDR_CTRL to other ADDR_CTRL trace
spacing(9)
3w
CARS321
CK center-to-center spacing (11)(12)
CARS322
CK spacing to other net(9)
4w
CARS323
Rcp(13)
Zo-1
Zo
Zo+1
Ω
CARS324
Rtt(13)(14)
Zo-5
Zo
Zo+5
Ω
(1) Max value is based upon conservative signal integrity approach. This value could be extended only if detailed signal integrity analysis of
rise time and fall time confirms desired operation.
(2) The use of vias should be minimized.
(3) Additional bypass capacitors are required when using the DDR_1V5 plane as the reference plane to allow the return current to jump
between the DDR_1V5 plane and the ground plane when the net class switches layers at a via.
(4) Non-mirrored configuration (all DDR3 memories on same side of PCB).
(5) Mirrored configuration (one DDR3 device on top of the board and one DDR3 device on the bottom).
(6) While this length can be increased for convenience, its length should be minimized.
(7) ADDR_CTRL net class only (not CK net class). Minimizing this skew is recommended, but not required.
(8) CK net class only.
(9) Center-to-center spacing is allowed to fall to minimum 2w for up to 1250 mils of routed length.
(10) The ADDR_CTRL net class of the other DDR EMIF is considered other DDR3 trace spacing.
(11) CK spacing set to ensure proper differential impedance.
(12) The most important thing to do is control the impedance so inadvertent impedance mismatches are not created. Generally speaking,
center-to-center spacing should be either 2w or slightly larger than 2w to achieve a differential impedance equal to twice the singleended
impedance, Zo.
(13) Source termination (series resistor at driver) is specifically not allowed.
(14) Termination values should be uniform across the net class.
(15) Via count difference may increase by 1 only if accurate 3-D modeling of the signal flight times – including accurately modeled signal
propagation through vias – has been applied to ensure all segment skew maximums are not exceeded.



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