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AM5729, AM5728, AM5726

SPRS953F – DECEMBER 2015 – REVISED MAY 2019

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Device and Documentation Support

TI offers an extensive line of development tools, including methods to evaluate the performance of the

processors, generate code, develop algorithm implementations, and fully integrate and debug software

and hardware modules as listed below.

9.1

Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all

microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix)

(for example, AM572x). Texas Instruments recommends two of three possible prefix designators for its

support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development

from engineering prototypes (TMDX) through fully qualified production devices and tools (TMDS).

Device development evolutionary flow:

Experimental device that is not necessarily representative of the final device's electrical

specifications and may not use production assembly flow.

Prototype device that is not necessarily the final silicon die and may not necessarily meet

final electrical specifications.

null

Production version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

TMDX

Development-support product that has not yet completed Texas Instruments internal

qualification testing.

TMDS

Fully-qualified development-support product.

X and P devices and TMDX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices and TMDS development-support tools have been characterized fully, and the quality

and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production

devices. Texas Instruments recommends that these devices not be used in any production system

because their expected end-use failure rate still is undefined. Only qualified production devices are to be

used.

For orderable part numbers of AM572x devices in the ABC package type, see the Package Option

Addendum of this document, the TI website (ti.com), or contact your TI sales representative.

For additional description of the device nomenclature markings on the die, see the Silicon Errata (literature

number SPRZ429).

9.1.1

Standard Package Symbolization

NOTE

Some devices may have a cosmetic circular marking visible on the top of the device package

which results from the production test process. In addition, some devices may also show a

color variation in the package substrate which results from the substrate manufacturer.

These differences are cosmetic only with no reliability impact.

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