MAX5113 datasheet(2/27 Pages) MAXIM

2 / 27 page

Maxim Integrated

9-Channel, 14-Bit Current DAC

with SPI Interface

MAX5113

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

VDD to AGND .................…………………………..-0.3V to +4.0V

VSS to AGND........................................................-6.0V to +0.3V

VDDI to AGND ......................................................-0.3V to +6.0V

OP6 to AGN.....the higher of (VDD - 9V), (VSS - 0.3V) and -6.0V to

the lower of (VDD + 0.3V) and +4.0V

OP1 to OP5 and OP7, OP8,

OP9 to AGND...-0.3V to the lower of (VDD + 0.3V) and +4.0V

DOUT to DGND................. -0.3V to the lower of (VDDIO + 0.3V)

and +6.0V

N.C. to AGND......-0.3V to the lower of (VDD + 0.3V) and +4.0V

Digital I/Os to DGND............................................-0.3V to +6.0V

AGND to DGND ...................................................-0.3V to +0.3V

All Other Pins to AGND...………………………….-0.3V to +4.0V

Continuous Power Dissipation (TA = +70NC)

WLP (derate at 26.3mW/NC above +70NC).................. 2104mW

TQFN (derate at 34.5mW/NC above +70NC)..............2758mW

Maximum Current Into Any Pin ........................................380mA

Operating Temperature Range........................ -40NC to +105NC

Storage Temperature Range............................ -65NC to +150NC

Junction Temperature .....................................................+150NC

Lead Temperature (TQFN only, soldering, 10s) .............+300NC

Soldering Temperature (reflow) ......................................+260NC

ELECTRICAL CHARACTERISTICS

(VDD = +2.6V to +3.3V, VSS = -4.75V to -5.46V, VDDI = +1.8V to +5.25V, AGND = DGND, TA = -40NC to +105NC, VOP1–VOP5 = VOP6

sourcing = VOP7, VOP8, and VOP9 = VDD - 1V, VOP6 sinking = VSS + 1V, unless otherwise noted. Typical specifications are at VDD

= +3.0V, VSS = -5.2V, TA = +25NC. Specifications apply to all DACs and outputs, unless otherwise noted.) (Note 2)

ABSOLUTE MAXIMUM RATINGS

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

Package Thermal Characteristics (Note 1)

TQFN

Junction-to-Ambient Thermal Resistance (

qJA) ..........29NC/W

Junction-to-Case Thermal Resistance (

qJC) ..............1.7NC/W

WLP

Junction-to-Ambient Thermal Resistance (

qJA) ..........38NC/W

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

STATIC PERFORMANCE

Resolution

Bits

Differential Nonlinearity

DNL

Guaranteed monotonic

0.5

1.0

LSB

Integral Nonlinearity

INL

OP1–OP6 source and OP9

LSB

OP6 sink

Ideal Gain

IGAIN

IMAX/214

mA/LSB

Gain Error (Note 3)

All but OP3, 2mA and OP6 sink

1.3

%FS

OP3, 2mA

1.5

OP6 sink

Gain Error Tempco (Note 4)

GETC

All but OP6 sink

ppm/NC

OP6 sink

Full-Scale Output

IMAX

OP1 and OP2

OP3

2mA FS range

20mA FS range

OP4

OP5

180

OP6 current source

300

OP6 current sink

-60

OP7

OP8 and OP9

15mA FS range

35mA FS range

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